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Displaying 1951 - 1975 of 2724

Internet-Based Surface Metrology Algorithm Testing System

December 1, 2004
Author(s)
Son H. Bui, Thomas B. Renegar, Theodore V. Vorburger, Jayaraman Raja, Mark C. Malburg
This paper presents the development of an Internet-based surface metrology algorithm testing system. The system includes peer-reviewed surface analysis tools and a surface texture specimen database for parameter evaluation and algorithm verification. The

Traceable Pico-Meter Level Step Height Metrology

December 1, 2004
Author(s)
Ndubuisi G. Orji, Ronald G. Dixson, Joseph Fu, Theodore V. Vorburger
The atomic force microscope (AFM) increasingly being used as a metrology tool in the semiconductor industry where the features measured are at the nanometer level and continue to decrease. Usually the height sensors of the AFM are calibrated using step

NNI Workshop Instrumentation and Metrology for Nanotechnology

November 1, 2004
Author(s)
Michael T. Postek, J J. Pellegrino
The NNI Interagency Workshop on Instrumentation and Metrology for Nanotechnology Grand Challenges was held on January 27-29, 2004 in Gaithersburg, Maryland, and was cosponsored by the National Institute of Standards and Technology (NIST), an agency of the

Virtual Surface Calibration and Computational Uncertainty

October 1, 2004
Author(s)
Son H. Bui, Theodore V. Vorburger, Thomas B. Renegar
This paper presents the development of a virtual surface calibration database for parameter evaluation and algorithm verification. The database runs from a web site at the National Institute of Standards and Technology (NIST), USA. Companies, universities

A Buckling-Based Metrology for Measuring the Elastic Moduli of Polymeric Thin Films

August 1, 2004
Author(s)
Christopher Stafford, Eva Simonyi, C Harrison, Kathryn Beers, Alamgir Karim, Eric J. Amis, Mark R. VanLandingham, H C. Kim, W Volksen, R D. Miller
As technology continues towards smaller, thinner and lighter devices, more stringent demands are placed on thin polymer films as diffusion barriers, dielectric coatings, electronic packaging and so on. Therefore, there is a growing need for testing

Quantifying Uncertainty in Nuclear Analytical Measurements

July 1, 2004
Author(s)
Lloyd A. Currie
This document resulted from a request at an International Atomic Energy Agency Consultants' Meeting. Information is based on a document Foundationsand future of detection and quantification limits prepared for the 1996 Proceedings of the Joint Statistical

Refractometry Using a Helium Standard

July 1, 2004
Author(s)
Jack A. Stone Jr., Alois Stejskal
The refractive index of helium at atmospheric pressure can be calculated from first principles with a very low uncertainty, on the order of 10^-10. Furthermore, the low refractive index of helium puts minimal demands on the pressure and temperature

Test of CD-SEM Shape-Sensitive Linewidth Measurement

July 1, 2004
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
In a model-based library (MBL) approach to scanning electron microscope (SEM) linewidth measurement, a library of simulation results for a range of lineshapes is searched for a match to the measured image of the unknown line. Compared to standard

Gas Flowmeter Calibrations with the 34 L and 677 L PVTt Standards

June 23, 2004
Author(s)
John D. Wright, Aaron N. Johnson, Michael R. Moldover, Gina M. Kline
This document provides a description of the 34 L and 677 L pressure, volume, temperature, and time (PVTt) primary gas flow standards operated by the National Institute of Standards and Technology (NIST) Fluid Flow Group. These facilities are used to

Active Vibration Isolation for a Long-Range Scanning Tunneling Microscope

June 1, 2004
Author(s)
K J. Lan, J Y. Yen, John A. Kramar
Vibration Isolation or control is critical for the optimum operation of the Molecular Measuring Machine (M3), a high-resolution, length-metrology instrument at the National Institute of Standards and Technology. This paper describes the extension of the M3

Evaluation of New In-Chip and Arrayed Line Overlay Target Designs

May 24, 2004
Author(s)
M P. Davidson, M R. Bishop, Robert D. Larrabee, Michael T. Stocker, Jay S. Jun, Egon Marx, Richard M. Silver, Ravikiran Attota
Two types of overlay targets have been designed and evaluated for the study of optical overlay metrology. They are in-chip and arrayed overlay targets. In-chip targets are three-bar two-level targets designed to be placed in or near the active device area

Laser Sample Stage-Based Image Resolution Enhancement Method for SEMs

May 24, 2004
Author(s)
Andras Vladar, Crossley E. Jayewardene, Bradley N. Damazo, William J. Keery, Michael T. Postek
The development of a very fast, very accurate laser stage measurement system facilitates a new method to enhance the image and line scan resolution of scanning electron microscopes (SEMs). This method, allows for fast signal intensity and displacement

Reference Metrology Using a Next Generation CD-AFM

May 24, 2004
Author(s)
Ronald G. Dixson, Angela Guerry
International SEMATECH (ISMT and the National Institute of Standards and Technology (NIST) are working together to improve the traceability of AFM dimensional metrology in semiconductor manufacturing. Due to the unique metrology requirements and the rapid

NIST SP430, Household Weights and Measures

May 15, 2004
Author(s)
Kenneth S. Butcher
The purpose of this publication is to present, in a convenient form, the weights and measures tables most useful for household purposes, together with associated weights and measures information of general household interests. It also provides basic metric
Displaying 1951 - 1975 of 2724
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