May 27, 2015
Author(s)
Chukwudi A. Okoro, Lyle E. Levine, Yaw S. Obeng, Ruqing Xu
… In this work, an experimental study of the influence of Cu … studied; 3 µm, 5 µm and 8 µm, all of which were fabricated in a single chip. Prior to the measurements, the die was … microstructure. The measured mean hydrostatic stresses in the Cu TSV were 185±14 MPa (3 µm Cu TSV diameter), 147±10 …