Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications

NIST Authors in Bold

Displaying 2526 - 2550 of 4635

Designing High-Performance PbS and PbSe Nanocrystal Electronic Devices through Stepwise, Post-Synthesis, Colloidal Atomic Layer Deposition

February 6, 2014
Author(s)
Soong Ju Oh, Nathaniel E. Berry, Hi-Hyuk Choi, E. A. Gaulding, Hangfei Lin, Taejong Paik, Benjamin T. Diroll, Shinichiro Muramoto, Murray B. Christopher, Cherie R. Kagan
… oxygen sensitivity, and introduction of many midgap and trap states. Lead chloride treatment creates a well-passivated, trap-free shell that stabilizes NCs structurally, optically …

Graphene microcapsule arrays for combinatorial electron microscopy and spectroscopy in liquids

April 27, 2017
Author(s)
Alexander Yulaev, Hongxuan Guo, Evgheni Strelcov, Lei Chen, Ivan Vlasssiouk, Andrei Kolmakov
An atomic-scale thickness, molecular impermeability, low atomic number, and mechanical strength make graphene an ideal electron transparent membrane for scanning electron microscopy and spectroscopy in liquids. Here, we present a novel sample platform made

New Steel Gravity Connection Details for Enhanced Integrity

April 23, 2015
Author(s)
Jonathan M. Weigand, Jeffrey W. Berman
Recent large-scale tests have found that Steel Gravity Framing Systems (SGFSs) with conventional connections were inadequate to support the integrity gravity load combinations under column removal scenarios. To address this issue, detailed connection

Metrology Needs for TSV Fabrication

March 4, 2014
Author(s)
Victor H. Vartanian, Richard A. Allen, Larry Smith, Klaus Hummler, Steve Olson, Brian Sapp
This paper focuses on the metrology needs and challenges of through silicon via (TSV) fabrication, consisting of TSV etch, liner, barrier, and seed (L/B/S) depositions, copper plating, and copper CMP. These TSVs, with typical dimensions within a factor of

A W-band polarization converter and isolator

June 6, 2007
Author(s)
Charles Dietlein, A. Luukanen, Zoya Popovic, Erich N. Grossman
This paper presents a 95-GHz printed low-loss linear-to-circular polarizer designed as a component of an active direct-detection millimeter-wave imaging system. The periodic printed structure presents different reactances to the TE and TM polarizations
Displaying 2526 - 2550 of 4635
Was this page helpful?