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Application of a Buffer Layer for the Dielectric Measurement of Thin Polymer Films
Published
Author(s)
C. K. Chiang, W Sakai
Abstract
A buffered dielectric measurement method was described. We added a thin buffer polymer layer to a polymer film before depositing aluminum electrodes. This is a modification to conventional parallel plate dielectric constant measurement method. It still has well-defined geometric factor for determining the dielectric constant. We designed the buffered layer with simple RC model. It was determined that the buffer layer should be a high dielectric constant polymer. Two high dielectric constant polymers were selected to be buffer layers. Layered samples of with structure ABA and ABC were discussed, where A is the buffering layer. We show that the method not only provide a way to preserve the structure of special polymer films, but also capable to adjusting its electrical characterization to a convenient level.
Proceedings Title
Electrically Based Microstructural Characterization, Symposium R | | Symposium R Electrically Based Microstructural Characterization III | Materials Research Society
Chiang, C.
and Sakai, W.
(2002),
Application of a Buffer Layer for the Dielectric Measurement of Thin Polymer Films, Electrically Based Microstructural Characterization, Symposium R | | Symposium R Electrically Based Microstructural Characterization III | Materials Research Society, MA, MA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852107
(Accessed October 16, 2025)