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Application of a Buffer Layer for the Dielectric Measurement of Thin Polymer Films

Published

Author(s)

C. K. Chiang, W Sakai

Abstract

A buffered dielectric measurement method was described. We added a thin buffer polymer layer to a polymer film before depositing aluminum electrodes. This is a modification to conventional parallel plate dielectric constant measurement method. It still has well-defined geometric factor for determining the dielectric constant. We designed the buffered layer with simple RC model. It was determined that the buffer layer should be a high dielectric constant polymer. Two high dielectric constant polymers were selected to be buffer layers. Layered samples of with structure ABA and ABC were discussed, where A is the buffering layer. We show that the method not only provide a way to preserve the structure of special polymer films, but also capable to adjusting its electrical characterization to a convenient level.
Proceedings Title
Electrically Based Microstructural Characterization, Symposium R | | Symposium R Electrically Based Microstructural Characterization III | Materials Research Society
Volume
699
Conference Dates
November 1, 2001
Conference Location
MA, MA
Conference Title
Materials Research Society Symposium Proceedings

Keywords

buffer, dielectric constant, layered, model, polymer film, thin film

Citation

Chiang, C. and Sakai, W. (2002), Application of a Buffer Layer for the Dielectric Measurement of Thin Polymer Films, Electrically Based Microstructural Characterization, Symposium R | | Symposium R Electrically Based Microstructural Characterization III | Materials Research Society, MA, MA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852107 (Accessed May 23, 2024)

Issues

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Created December 31, 2001, Updated October 12, 2021