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Manufacturing

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Displaying 1451 - 1475 of 2179

Relaxation Effects in Small Critical Nozzles

January 1, 2006
Author(s)
Aaron N. Johnson, C L. Merkle, Michael R. Moldover, John D. Wright
We computed the flow of four gases (He, N 2, CO 2, and SF 6) through a critical nozzle by augmenting traditional computational fluid dynamics (CFD) with a rate equation that accounts for τ relax, a species-dependent relaxation time that characterizes the

Topography Measurements and Applications

January 1, 2006
Author(s)
Jun-Feng Song, Theodore V. Vorburger
Based on auto- and cross-correlation functions (ACF and CCF), a new surface parameter called profile (or topography) difference, Ds, has been developed for quantifying differences between 2D profiles or between 3D topographies with a single number. When Ds

Three-dimensional Scanning Optical Tweezers

December 5, 2005
Author(s)
Thomas W. LeBrun, T W. Hwang, I Y. Park, Jun-Feng Song, Yong-Gu Lee, Nicholas G. Dagalakis, Cedric V. Gagnon, Arvind K. Balijepalli
There are several new tools for manipulating microscopic objects. Among them, optical tweezers (OT) has two distinguishing advantages. Firstly, OT can easily release an object without the need of a complicated detaching scheme. Secondly, it is anticipated

Analysis and Design of Parallel Mechanisms with Flexure Joints

December 1, 2005
Author(s)
Byoung H. Kang, J Wen, Nicholas Dagalakis, Jason J. Gorman
Flexure joints are frequently used in precision-motion stages and microrobotic mechanisms due to their monolithic construction. The joint compliance, however, can affect the static and dynamic performance of the overall mechanism. In this paper, we

Advanced Metrology Needs for Nanotechnology and Nanomanufacturing

November 1, 2005
Author(s)
Michael T. Postek, John S. Villarrubia, Andras Vladar
Advances in fundamental nanoscience, design of nanomaterials, and ultimately manufacturing of nanometer scale products all depend to some degree on the capability to accurately and reproducibly measure dimensions, properties, and performance

Scanning electron microscope dimensional metrology using a model-based library

November 1, 2005
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
The semiconductor electronics industry places significant demands upon secondary electron imaging to obtain dimensional measurements that are used for process control or failure analysis. Tolerances for measurement uncertainty and repeatability are smaller

A Benefit/Cost Model for Metrology in Manufacturing

October 24, 2005
Author(s)
James E. Potzick
Every measurement of a feature's size or placement on a wafer or photomask is made for a reason. Usually a measurement leads to a decision, often involving a process adjustment or business transaction, and there are costs and benefits attached to these

The Study of Silicon Stepped Surfaces as Atomic Force Microscope Calib Standards With a Calibrated AFM at NIST

September 29, 2005
Author(s)
V W. Tsai, Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, R Koning, Richard M. Silver, Edwin R. Williams
Due to the limitations of modern manufacturing technology, there is no commercial height artifact at the sub-nanometer scale currently available. The single-atom steps on a cleaned silicon (111) surface with a height of 0.314 nm, derived from the lattice

Nanometer Resolution Metrology with the NIST Molecular Measuring Machine

September 23, 2005
Author(s)
John A. Kramar
Nanometre accuracy and resolution metrology over technically relevant areas is becoming a necessity for the progress of nanomanufacturing. At the National Institute of Standards and Technology, we are developing the Molecular Measuring Machine, a scanned

A Modular System Architecture for Agile Assembly of Nanocomponents using Optical Tweezers

September 10, 2005
Author(s)
Arvind K. Balijepalli, Thomas W. LeBrun, Cedric V. Gagnon, Yong-Gu Lee, Nicholas G. Dagalakis
In order to realize the flexibility optical trapping offers as a nanoassembly tool, we need to develop natural and intuitiveinterfaces to assemble large quantities of nanocomponents quickly and cheaply. We propose a system to create such aninterface that

Issues in Line Edge and Linewidth Roughness Metrology

September 9, 2005
Author(s)
John S. Villarrubia
In semiconductor electronics applications, line edge and linewidth roughness are generally measured using a root mean square (RMS) metric. The true value of RMS roughness depends upon the length of edge or line that is measured and the chosen sampling

Characterization of Optical Traps Using On-Line Estimation Methods

August 26, 2005
Author(s)
Jason J. Gorman, Thomas W. LeBrun, et al
System identification methods are presented for the estimation of the characteristic frequency of an optically trapped particle. These methods are more amenable to automated on-line measurements and are believed to be less prone to erroneous results

Dynamic Modeling and Vibration Analysis of a UHV Scanning Tunneling

August 17, 2005
Author(s)
Sumanth B. Chikkamaranahalli, R. R. Vallance, Bradley N. Damazo, Richard M. Silver, James D. Gilsinn
Techniques based on scanning probe microscopy (SPM) are used to fabricate surface structures with dimensions ranging from 10 - 100mm. These structures have been fabricated and imaged using a scanning tunneling microscope (STM), and the STM requires the tip

A Fiber Probe for CMM Measurements of Small Features

August 1, 2005
Author(s)
Jack A. Stone Jr., Balasubramanian Muralikrishnan, John R. Stoup
We report on performance of a new form of fiber probe, which can be used in conjunction with a coordinate measuring machine (CMM) for microfeature measurement. The probe stylus is a glass fiber with a small ball (?75 ?m diameter) glued to the end. When the

A Simulation Study of Repeatability and Bias in the CD-SEM

July 1, 2005
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
Abstract: The ability of a critical dimension scanning electron microscope (CD-SEM) to resolve differences in the widths of two lines depends on the instrument?s measurement repeatability and any sample dependent biases. The dependence of repeatability and

Development of Multiple Beam Optical Tweezers

June 1, 2005
Author(s)
Dongjin Lee, Thomas W. LeBrun, Arvind Balijepalli, Jason J. Gorman, Cedric V. Gagnon, Daehie Hong, Esther H. Chang
This paper presents the design of a multiple beam optical tweezers instrument used for manipulating micro/nano-sized components. The basic equations used in designing the optical tweezers are derived and the stable and time-sharing multiple beam optical

SysML and UML 2 Support for Activity Modeling

June 1, 2005
Author(s)
Conrad E. Bock
This article describes activity modeling as specified by the Systems Modeling Language (SysML) and the finalization of the Unified Modeling Language version 2 (UML 2). It reviews and updates an earlier proposed alignment between Enhanced Functional Flow
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