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Manufacturing

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Displaying 1426 - 1450 of 2179

Damping mechanisms for precision applications in UHV environment

May 1, 2006
Author(s)
Sumanth B. Chikkamaranahalli, R. R. Vallance, Bradley N. Damazo, Richard M. Silver
Surface analysis techniques such as scanning probe microscopy (SPM) have undergone significant advances and are attractive for application to electron and optical devices such as micro lenses, vacuum tubes, electron tubes, etc. For surface stability

Manufacturing Interoperability

May 1, 2006
Author(s)
Steven R. Ray, Albert T. Jones
National Institute of Standards and Technology, Gaithersburg, MD 20899, USA ABSTRACT: As manufacturing and commerce become ever more global in nature, companies are increasingly dependent upon the efficient and effective exchange of information with their

Experience in the Exchange of Procedural Shape Models Using ISO 10303 (STEP)

March 30, 2006
Author(s)
Mike Pratt, Junhwan Kim
The international standard ISO 10303 (STEP) is being extended to permit the exchange of procedurally defined shape models, with additional parameterization and constraint information, between CAD systems. The transfer of parameterized assembly models is an

Bias Reduction in Roughness Measurement through SEM Noise Removal

March 24, 2006
Author(s)
R Katz, C D. Chase, R Kris, R Peltinov, John S. Villarrubia, B Bunday
The importance of Critical Dimension (CD) roughness metrics such as Line and Contact edge roughness (LER, CER) and their associated width metrics (LWR, CWR) have been dealt with widely in the literature and are becoming semiconductor industry standards

Early Results From the NIST M48 CMM in the New AML Facility

March 3, 2006
Author(s)
John R. Stoup, Bryon S. Faust, Theodore D. Doiron
The Advanced Measurement Laboratory at NIST in Gaithersburg has already provided real, measurable improvement in some dimensional metrology measurement processes at NIST, most notably in the performance of the NIST Moore M48 coordinate measuring machine1

Assembly Model Representation from Conceptual to the Detailed Design

March 1, 2006
Author(s)
Sudarsan Rachuri, Y H. Han, Sebti Foufou, Shaw C. Feng, Utpal Roy, Fujun Wang, Ram D. Sriram, Kevin W. Lyons
The important issue of mechanical assemblies has been a subject of intense research over the past several years. Most electromechanical products are assemblies of several components, for various technical as well as economic reasons. This paper provides an

Koehler Illumination for High-Resolution Optical Metrology

March 1, 2006
Author(s)
Martin Y. Sohn, Bryan M. Barnes, Lowell P. Howard, Richard M. Silver, Ravikiran Attota, Michael T. Stocker
Accurate preparation of illumination is critical for high-resolution optical metrology applications such as line width and overlay measurements. To improve the detailed evaluation and alignment of the illumination optics, we have separated Koehler

Progress on Implementation of a CD-AFM Based Reference Measurement System

March 1, 2006
Author(s)
Ndubuisi G. Orji, Angela Martinez, Ronald G. Dixson, J Allgair
The National Institute of Standards and Technology (NIST) and SEMATECH are working to address traceability issues in semiconductor dimensional metrology. In semiconductor manufacturing, many of the measurements made in the fab are not traceable to the SI

The Limits of Image-Based Optical Metrology

March 1, 2006
Author(s)
Richard M. Silver, Bryan M. Barnes, Ravikiran Attota, Jay S. Jun, James J. Filliben, Juan Soto, Michael T. Stocker, P Lipscomb, Egon Marx, Heather J. Patrick, Ronald G. Dixson, Robert D. Larrabee
An overview of the challenges encountered in imaging device-sized features using optical techniques recently developed in our laboratories is presented in this paper. We have developed a set of techniques we refer to as scatterfield microscopy which allows

Traceable Atomic Force Microscope Dimensional Metrology at NIST

March 1, 2006
Author(s)
Ronald G. Dixson, Ndubuisi G. Orji, Joseph Fu, Michael W. Cresswell, Richard A. Allen, William F. Guthrie
The National Institute of Standards and Technology (NIST) has a multifaceted program in atomic force microscope (AFM) dimensional metrology. There are two major instruments being used for traceable measurements at NIST. The first is a custom in-house

A Flexible System Framework for a Nanoassembly Cell Using Optical Tweezers

January 1, 2006
Author(s)
Arvind K. Balijepalli, Thomas W. LeBrun, Satyandra K. Gupta
The optical tweezers instrument is a unique tool for directed assembly of nanocomponents. In order to function as a viable nanomanufacturing tool, a software architecture is needed to run the optical tweezers hardware, provide an effective user interface

Correlation of Topography Measurements of NIST SRM 2460 Standard Bullets by Four Techniques

January 1, 2006
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Thomas Brian Renegar, Hyug-Gyo Rhee, A Zheng, L Ma, John M. Libert, Susan M. Ballou, B Bachrach, K Bogart
Three optical instruments including an interferometric microscope, a Nipkow disk confocal microscope and a laser scanning confocal microscope are used for the measurements of bullet profile signatures of a NIST (National Institute of Standards and

Correlation of Topography Measurements of NIST SRM 2460 Standard Bullets by Four Techniques

January 1, 2006
Author(s)
Jun-Feng Song, Theodore V. Vorburger, Thomas Brian Renegar, Xiaoyu Alan Zheng, Hyug-Gyo Rhee, John M. Libert, Li Ma, K Bogart, Susan M. Ballou, B Bachrach
Three optical instruments including an interferometric microscope, a Nipkow disk confocal microscope and a laser scanning confocal microscope are used for the measurements of bullet profile signatures of a National Institute of Standards and Technology

Enhanced Capabilities of the NIST Fiber Probe for Microfeature Metrology

January 1, 2006
Author(s)
Bala Muralikrishnan, Jack A. Stone Jr., John R. Stoup
We have previously reported work in the area of fiber probe development at NIST for micro feature measurement. This probe, which we refer to as the Fiber Deflection Probe, functions by optically imaging the stem from two orthogonal directions a few

Fiber Deflection Probe for Small Hole Metrology

January 1, 2006
Author(s)
Balasubramanian Muralikrishnan, Jack A. Stone Jr., John R. Stoup
This paper presents the development of a new probing method for Coordinate Measuring Machines (CMM) to inspect diameter and form of small holes. The technique, referred to as fiber deflection probing, can be used for holes of approximately 100 mm nominal

Fiber Deflection Probe Uncertainty Analysis for Micro Holes

January 1, 2006
Author(s)
Bala Muralikrishnan, Jack A. Stone Jr., John R. Stoup
We have recently reported on a new probe, the Fiber Deflection Probe (FDP), for diameter and form measurement of large aspect ratio micro-holes (100 um nominal diameter, 5 mm deep). In this paper, we briefly review the measurement principle of the FDP

International Comparison of Surface Roughness and Step Height (Depth) Standards, SIM 4.8

January 1, 2006
Author(s)
K Doytchinov, F Kornblit, C C. Castellanos, J C. Oliveira, Thomas Brian Renegar, Theodore V. Vorburger
Calibration services of 5 countries from the SIM region are compared through measurements of surface roughness and step height standards. A surface roughness standard with a nominal Ra value of 0.2 mm, a surface roughness standard with a nominal Ra value

Large-Scale Metrology Instrument Performance Evaluations at NIST

January 1, 2006
Author(s)
William T. Estler, Daniel S. Sawyer, Bruce R. Borchardt, Steven D. Phillips
The ASME B89 Committee on Dimensional Metrology has approved a new American National Standard B89.4.19 - Performance Evaluation of Laser Based Spherical Coordinate Measurement Systems. This Standard, to be published in 2006, specifies test methods for

Nano- and Atomic-Scale Length Metrology

January 1, 2006
Author(s)
Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, Ndubuisi George Orji, Shaw C. Feng, Michael W. Cresswell, Richard A. Allen, William F. Guthrie, Wei Chu
We discuss nano-scale length metrology of linewidth, step height, and line edge roughness (LER). These properties are of growing importance to the function and specification of semiconductor devices as the dimensions of semiconductor devices shrink to the

Nano-Tip Electron Gun for the Scanning Electron Microscope

January 1, 2006
Author(s)
Andras Vladar, Zsolt Radi, Michael T. Postek, David C. Joy
Through this study the most important questions and problems associated with nano-tips and their possible applications to SEMs were investigated. These were related to the tip making procedures, the theoretical assessment of the Hitachi S-6000 critical

NIST Accomplishments in Nanotechnology

January 1, 2006
Author(s)
Michael T. Postek, Joseph J. Kopanski, David A. Wollman
This document includes a list of selected NIST accomplishments in nanotechnology for the period of fiscal years 2004 and 2005. These accomplishments are grouped into the NNI s Program Component Areas (PCAs), which are defined in the text. The NNI has
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