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Jae H. Lee, Steven J. Fenves, Conrad E. Bock, Sudarsan Rachuri, Hyo-Won Suh, Xenia Fiorentini, Ram D. Sriram
Supporting different stakeholder viewpoints across the products entire lifecycle requires semantic richness to represent product related information and thus enable multi-view engineering simulations. This paper proposes a multi-level product modeling
Craig I. Schlenoff, Brian A. Weiss, Michelle P. Steves
For the past six years, personnel from the National Institute of Standards and Technology (NIST) have served as the Independent Evaluation Team (IET) for two major DARPA programs. DARPA ASSIST (Advanced Soldier Sensor Information System and Technology) is
Powered Industrial Vehicles, such as forklifts, are widely used in manufacturing and other industries. The National Institute of Standards and Technology's Intelligent System Division has been researching advanced 2D and 3D imaging sensors and their use
Erik Lindskog, Linus Lundh, Jonatan K. Berglund, Yung-Tsun Lee, Anders Skoogh, Bjorn Johansson
Effective assessment and communication of environmental footprint is increasingly important to process development and marketing purposes. Traditionally, static methods have been applied to analyze the environmental impact during a product's life cycle
Jonatan K. Berglund, John L. Michaloski, Swee K. Leong, Guodong Shao, Frank H. Riddick, Jorge Arinez, Stephan Biller
A growing number of manufacturing industries are initiating efforts to address sustainability issues. A study by the National Association of Manufacturers indicated that the manufacturing sector currently accounts for over a third of all energy consumed in
Joseph Maurer, John Hudson, Steven E. Fick, Thomas P. Moffat, Gordon A. Shaw
Electrochemical micromachining (ECMM) with ultrashort voltage pulses has been used to fabricate microstructures on a NiTi shape memory alloy (SMA). Because of its unique properties, NiTi is a desirable material for use in various applications including
Ronnie R. Fesperman Jr., M A. Donmez, Shawn P. Moylan
Many new compact ultra-precision linear translation stages with exceptionally long ranges of motion on the order of tens of millimeters and positioning resolutions on the order of a nanometer are finding their way into emerging nanotechnologies. This class
Balasubramanian Muralikrishnan, Wei Ren, Dennis S. Everett, Eric S. Stanfield, Theodore D. Doiron
Non-contact dimensional measurement of fuel cell plates is critical to the eventual rapid manufacture by supporting in-process measurement and control. This need has been identified by the Department of Energys Hydrogen Program, and by numerous
Kristine A. Bertness, Joshua R. Montague, Norman A. Sanford, Victor Bright, Charles T. Rogers
A variable-temperature, homodyne reflectometry measurement technique for detecting nanoscale mechanical motion has recently been developed. We have extended this technique to make the first all-electrical measurements of an ensemble of as-grown, c-axis
STEP AP210 (ISO 10303-210) supports a comprehensive functional network model representation. SPICE (Simulation Program with Integrated Circuit Emphasis) is a general purpose, industry standard, analog electronic circuit simulation. Originally developed at
Intelligent technologies within the military, law enforcement, and homeland security fields are continuously evolving. Testing these technologies is crucial to (1) inform the technology developers of specific aspects for enhancement, (2) request end-user
Paul W. Witherell, Anantha Narayanan Narayanan, Jae H. Lee, Sudarsan Rachuri
As information requirements have increased, domain models have become increasing complex and difficult to manage. Though domain-specific languages have been developed for domain experts, increasing their expressivity and decreasing their complexity, their
This report summarizes issues in manufacturing from the 2011 iNEMI MEMS Technology Roadmap, and shares the authors observations from the 2011 MEMS Industry Groups (MIG) Workshop on Device Testing and the 2012 ITRS MEMS Technology Working Groups (TWG)
Ndubuisi G. Orji, Ronald G. Dixson, Andras Vladar, Michael T. Postek
Contour metrology is one of the techniques used to verify optical proximity correction (OPC) in lithography models. The use of these methods, which are known as resolution enhancement techniques (RET), are necessitated by the continued decrease in feature
Michael T. Postek, Andras Vladar, John A. Dagata, Natalia Farkas, Bin Ming, Ryan Wagner, Arvind Raman, Robert J. Moon, Ronald Sabo, Theodore H. Wegner, James Beecher
The development of metrology for nanoparticles is a significant challenge. Cellulose nanocrystals (CNC) are one group of nanoparticles that have high potential economic value but present substantial challenges to the development of the measurement science
Michael T. Postek, Andras Vladar, Bin Ming, Charles Archie
Scanning electron microscopy has been employed as an imaging and measurement tool for more than 50 years and it continues as a primary tool in many research and manufacturing facilities across the world. A new challenger to this work is the helium ion
Charles R. McLean, Yung-Tsun Lee, Sanjay Jain, Charles W. Hutchings
The purpose of this document is to provide: 1) a compendium of information pertaining to incident management modeling and simulation, and 2) a foundation for the establishment of a modeling and simulation technical interest group whose focus is information
Guodong Shao, Alexander Brodsky, Jorge Arinez , Daniel A. Menasce , Paul Ammann
A growing number of manufacturing industries are initiating efforts to address sustainability issues. According to the National Association of Manufacturers, the manufacturing sector currently accounts for about one third of all energy consumed in the
Yong Sik Kim, Nicholas G. Dagalakis, Satyandra K. Gupta
Building a two degree-of-freedom (2 DOF) MEMS nanopositioner with decoupled X-Y motion has been a challenge in nanopositioner design. In this paper a novel design concept on making the decoupled motion of the MEMS nanopositioner is suggested. The suggested
Mark B. Campanelli, Jonatan K. Berglund, Sudarsan Rachuri
Sustainable manufacturing (SM) concerns the manufacture of products with regard to environmental, social, and economic impacts over the entire life cycle. With a primary focus on environmental concerns, life cycle assessment (LCA) can support SM practices
Advanced and intelligent systems within the manufacturing, military, homeland security, and automotive fields are constantly under development or improvement. Testing the performance of these technologies is critical to (1) update the system designers of
In this paper, we identify five main obstacles in the development of an industry-ready application of semantic knowledge management systems and discuss how each of these challenges can be addressed. These obstacles include the ease of new knowledge
Analog transducers (sensors or actuators) are widely used in industry. The Institute of Electrical and Electronics Engineers (IEEE) 1451.4 standard defines a mixed-mode communication protocol and the Transducer Electronic Data Sheet (TEDS) formats for
Kristine A. Bertness, Norman A. Sanford, Albert Davydov
The unique properties of GaN nanowires grown by molecular beam epitaxy are reviewed. These properties include the absence of residual strain, exclusion of most extended defects, long photoluminescence lifetime, low surface recombination velocity,and high