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ROADMAPPING MANUFACTURING NEEDS FOR MEMS TECHNOLOGIES

Published

Author(s)

Michael Gaitan, Karen Lightman

Abstract

This report summarizes issues in manufacturing from the 2011 iNEMI MEMS Technology Roadmap, and shares the authors’ observations from the 2011 MEMS Industry Group’s (MIG) Workshop on Device Testing and the 2012 ITRS MEMS Technology Working Group’s (TWG) roadmapping activities. Virtually all MEMS R&D investment has gone into the front-end of manufacturing (device and process development), yet the back-end (packaging and testing) generally consumes 2⁄3 of the total manufacturing cost. The development of a consensus opinion that articulates the issues that the industry faces at the back-end may be helpful in identifying opportunities for optimizing R&D investment to meet critical back-end manufacturing needs.
Citation
Technologies for Future Micro-Nano Manufacturing

Keywords

Technology Roadmapping, MIG, MEMS, iNEMI, ITRS, Back-End, Packaging, Device Testing
Created September 30, 2011, Updated July 28, 2017