ROADMAPPING MANUFACTURING NEEDS FOR MEMS TECHNOLOGIES
Michael Gaitan, Karen Lightman
This report summarizes issues in manufacturing from the 2011 iNEMI MEMS Technology Roadmap, and shares the authors observations from the 2011 MEMS Industry Groups (MIG) Workshop on Device Testing and the 2012 ITRS MEMS Technology Working Groups (TWG) roadmapping activities. Virtually all MEMS R&D investment has gone into the front-end of manufacturing (device and process development), yet the back-end (packaging and testing) generally consumes 2⁄3 of the total manufacturing cost. The development of a consensus opinion that articulates the issues that the industry faces at the back-end may be helpful in identifying opportunities for optimizing R&D investment to meet critical back-end manufacturing needs.