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Displaying 976 - 1000 of 1446

Conductive Carbon Nanotubes for Semiconductor Metrology

August 10, 2010
Author(s)
Joseph J. Kopanski, Victor H. Vartanian, Vladimir Mancevski, Phillip D. Rack, Ilona Sitnitsky, Matthew D. Bresin
This paper presents an evaluation of e-beam assisted deposition and welding of conductive carbon nanotube (c-CNT) tips for electrical scanning probe microscope measurements. Variations in CNT tip conductivity and contact resistance during fabrication were

Friction and Wear in Micro and Nanomachines

August 2, 2010
Author(s)
Maarten P. de Boer, Alex D. Corwin, Frank W. DelRio, W R. Ashurst
Friction and wear present both challenges and opportunities for micro- and nanosystems. In the sections that follow, we will describe theoretical underpinnings of multi-asperity friction, micromachined test structures to measure friction, and monolayer

Semiconductor Microelectronics and Nanoelectronics Programs

July 1, 2010
Author(s)
Joaquin (. Martinez, Yaw S. Obeng, Michele L. Buckley
The microelectronics industry supplies vital components to the electronics industry and to the U.S. economy, enabling repaid improvements in productivity and in new high technology growth industries such as electronic commerce and biotechnology. The

Measurement of residual stress field anisotropy at indentations in silicon

June 23, 2010
Author(s)
Yvonne B. Gerbig, Stephan J. Stranick, Robert F. Cook
The residual stress field around spherical indentations on single crystal silicon (Si) of different crystallographic orientation is mapped by confocal Raman microscopy. All orientations exhibit an anisotropic stress pattern with an orientation specific

Interlaboratory Comparison of Traceable Atomic Force Microscope Pitch Measurements

June 14, 2010
Author(s)
Ronald G. Dixson, Donald Chernoff, Shihua Wang, Theodore V. Vorburger, Ndubuisi G. Orji, Siew-Leng Tan, Joseph Fu
The National Institute of Standards and Technology (NIST), Advanced Surface Microscopy (ASM), and the National Metrology Centre (NMC) of the Agency for Science, Technology, and Research (A*STAR) in Singapore have undertaken a three-way interlaboratory
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