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Electronics

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Displaying 651 - 675 of 695

Growth of YBa2Cu3O7 thin films on MgO: the effect of substrate preparation

October 30, 1990
Author(s)
Stephen E. Russek, Brian H. Moeckly, D. K. Lathrop, R A. Buhrman, Jian Li, J. W. Mayer
We discuss the results of a study on growth by laser ablation of YBa2CuO7 thin films on polycrystalline and annealed vicinal (001) MgO substrates. In both instances the films were found to grow predominantly with c axis normal to the plane of the substrate

Growth of YBa2Cu3O7 thin films on MgO: the effect of substrate preparation

August 13, 1990
Author(s)
Stephen E. Russek
We discuss the results of a study of the effect of a substrate preparation on the microstructure and superconductive properties of YBa2Cu3O7 think films formed by laser ablation on (001) MgO substrates. Thermal annealing of the substrates is found to be

Damping of the Resonant Modes of a Rectangular Metal Package

January 1, 1989
Author(s)
Dylan F. Williams
When an electrical circuit is enclosed in a metal package large enough to support resonant modes within the frequencies of operation of the enclosed circuit, coupling between the circuit and these resonant cavity modes may disturb circuit operation. These

De-embedding Coplanar Probes with Planar Distributed Standards

December 1, 1988
Author(s)
Dylan F. Williams, Tom H. Miers
Two methods are used to de-embed coplanar probes using offset coplanar waveguide shorts and transmission lines. The accuracy of the de-embedded measurements is verified. The S parameters of lumped standards provided by the manufacturer of the probes are

A Coplanar Probe to Microstrip Transition

July 1, 1988
Author(s)
Dylan F. Williams, Tom H. Miers
A transition between a coplanar probe and a microstrip transmission line is reported. The transition is significant in that it does not require substrate via holes. A set of microstrip impedance standards were developed for the purpose of de-embedding the
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