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Conferences

Dimensional Metrology of Millimeter- and Sub-millimeter-scale Components

Author(s)
Theodore V. Vorburger, Jun-Feng Song, Joseph Fu, M Tundermann, Thomas Brian Renegar, Theodore D. Doiron, N G. Orji
Decreasing sizes and tolerances of engineering components bring a demand for decreasing uncertainty in the dimensional measurements of these parts. Hence there...

CIE Fundamentals for Color Measurements

Author(s)
Yoshi Ohno
The paper first overviews the CIE system of colorimetry, covering CIE 1931 color matching functions, XYZ tristimulus values, the x, y diagram, the 1976 u', v'...

Mutation Operators for Specifications

Author(s)
Paul E. Black, Vadim Okun, Yaacov Yesha
Testing has a vital support role in the software engineering process, but developing tests often takes significant resources. A formal specification is a...

The Trilogy Update of IEEE Std. C62.41

Author(s)
Francois D. Martzloff
Progress report on the restructuring of two IEEE standards concerned with surges in low-voltage a.c. power circuits into a Trilogy of three documents. First a...

Assessment of Sensitivity Advances in Near-Field Raman Spectroscopy

Author(s)
Chris A. Michaels, C E. Dentinger, Lee J. Richter, D B. Chase, Richard R. Cavanagh, Stephan J. Stranick
Near-field Raman spectroscopy can be used to obtain images with both chemical specificity and the subwavelength spatial resolution of near-field scanning...

The Ternary Eutectic of Sn-Ag-Cu Solder Alloys

Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
New measurements using precision thermal analysis and existing experimental data for the Sn-Ag-Cu system are summarized. For Sn-Ag-Cu alloys, the location of...
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