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Conferences

Sustainability through Lifecycle Synthesis of Material Information

April 19, 2013

Author(s)

Paul W. Witherell, Katherine C. Morris, Anantha Narayanan Narayanan, Jae H. Lee, Sudarsan Rachuri

The synthesis of material information across lifecycle stages will lay the foundation for a material information model to support sustainable decision making...

Performance of Steel Shear Tab Connections at Elevated Temperatures

April 16, 2013

Author(s)

Mina S. Seif, Joseph Main, Therese P. McAllister

At the present time, there is a lack of understanding of the performance of structures as complete systems under extreme loading conditions such as realistic...

EFFECT OF HIGH LUMINANCE SOURCES TO PERIPHERAL ADAPTATION STATE IN MESOPIC RANGE

April 15, 2013

Author(s)

Tatsukiyo (. Uchida, Yoshihiro Ohno

CIE 191:2010 recommends a mesopic photometry system that defines the spectral luminous efficiency function for peripheral visual tasks. For implementation of...

INFLUENCE OF CURRENT AND VOLTAGE HARMONIC DISTORTION ON THE POWER MEASUREMENT OF LED LAMPS AND LUMINAIRES

April 15, 2013

Author(s)

Christophe Martinsons, Yuqin Zong, C Cameron Miller, Yoshi Ohno

Specific issues appear in the measurement of the electrical power of AC-powered LED lamps and luminaires because they often generate harmonic currents in a wide...

Modeling and Simulation for Improving Ambulance Patient Compartment Design Standards

April 12, 2013

Author(s)

Deogratias Kibira, Yung-Tsun T. Lee, Allison Barnard Feeney, Jennifer L. Marshall, Larry Avery, Jennifer Moore, Carlotta Boone

Emergency medical service providers riding in ambulance patient compartments, while caring for patients, are at high risk of suffering injuries in case of a...

Enhancing 9 nm Node Dense Patterned Defect Optical Inspection using Polarization, Angle, and Focus

April 10, 2013

Author(s)

Bryan M. Barnes, Francois R. Goasmat, Martin Y. Sohn, Hui Zhou, Abraham Arceo

To measure the new SEMATECH 9 nm node Intentional Defect Array (IDA) and subsequent small, complex defects, a methodology has been used to exploit the rich...

Experimental Study of the Thermal Impacts on Wireless Sensor Batteries

April 10, 2013

Author(s)

Wenqi Guo, William M. Healy, Mengchu Zhou

Wireless sensor networks are being considered for application within buildings to control various equipment in different working environments. As wireless...

Gaps Analysis for CD Metrology Beyond the 22 nm Node

April 10, 2013

Author(s)

Benjamin D. Bunday, Thomas Germer, Victor H. Vartanian, Aaron Cordes, Aron Cepler, Charles Settens

This paper will examine the future for critical dimension (CD) metrology. First we will present the extensive list of applications for which CD metrology...

Dictionary Learning from Ambiguously Labeled Data

April 9, 2013

Author(s)

P J. Phillips, Yi-Chen Chen, Vishal M. Patel, Jaishanker K. Pillai, Rama Chellappa

We propose a novel dictionary-based learning method for ambiguously labeled multiclass classification, where each training sample has multiple labels and only...

Critical Dimension small angel X-ray scattering measurements of FinFET and 3D memory structures

April 8, 2013

Author(s)

Regis J. Kline, Daniel F. Sunday, Chengqing C. Wang, Wen-Li Wu, Charlie Settens, Bunday Benjamin, Brad Thiel, Matyi Richard

Critical dimension small angle X-ray scattering (CD-SAXS) has been identified as a potential solution for measurement of nanoscale lithographic features by...

Estimating Uncertainties in Antenna Measurements

April 8, 2013

Author(s)

Michael H. Francis

We describe general methods of estimating uncertainties in antenna measurements. These include estimates based on theory (analysis1), simulation, and altering...

Intercomparison between optical and x-ray scatterometry measurements of FinFET structures

April 8, 2013

Author(s)

Paul Lemaillet, Thomas Germer, Regis J. Kline, Daniel Sunday, Chengqing C. Wang, Wen-Li Wu

In this paper, we present a comparison of profile measurements of vertical field effect transistor (FinFET) fin arrays by optical critical dimension (OCD)...

Performance Evaluation of a Robotically Controlled Millimeter-Wave Near-Field Pattern Range At the NIST

April 7, 2013

Author(s)

David R. Novotny, Josh Gordon, Jason Coder, Michael Francis, Jeffrey R. Guerrieri

The Antenna Metrology Laboratory at the National Institute of Standards and Technology, USA (NIST) is developing a robotically controlled near-field pattern...

Modeling Scanning Electron Microscope Measurements with Charging

April 3, 2013

Author(s)

John S. Villarrubia

A Basic CWE-121 Buffer Overflow Effectiveness Test Suite

April 1, 2013

Author(s)

Paul E. Black, Hsiao-Ming M. Koo, Thomas F. Irish

Phase 3 of MITRE's Common Weakness Enumeration (CWE) Compatibility and Effectiveness program allows a customer to understand how effective a software assurance...

The evaluation of photo/e-beam complementary grayscale lithography for high topography 3D structure

March 29, 2013

Author(s)

Liya Yu, Richard J. Kasica, Robert D. Newby, Lei Chen, Vincent K. Luciani

This article demonstrates and evaluates photo/e-beam grayscale complementary lithography processes for the fabrication of large area, high topography grayscale...

Computational Fluid Dynamic (CFD) Investigation of NISTs Scale Model Smokestack Simulator

March 27, 2013

Author(s)

Aaron N. Johnson, Jacob E. Ricker, Joey T. Boyd

Accurate flow measurements are essential to quantifying the amount of greenhouse gases (GHGs) and other pollutants emitted from the smokestacks of coal-fired...

Metrology For Organic Monolayers On Cobalt Surfaces

March 27, 2013

Author(s)

Sujitra J. Pookpanratana, Leigh K. Lydecker, Hyuk-Jae Jang, Curt A. Richter, Christina A. Hacker

The MEMS 5-in-1 Test Chips (Reference Materials 8096 and 8097)

March 27, 2013

Author(s)

Janet M. Cassard, Jon C. Geist, Craig D. McGray, Richard A. Allen, Muhammad Y. Afridi, Brian J. Nablo, Michael Gaitan, David G. Seiler

This paper presents an overview of the Microelectromechanical Systems (MEMS) 5-in-1 Reference Material (RM), which is a single test chip with test structures...

Developing Standards for Commercial Electric Vehicle Fueling and Submetering

March 27, 2013

Author(s)

Marc A. Buttler

NIST plays a role in the development of standards for commercial measuring systems that are used in legal metrology in the U.S. NIST Handbook 130 and NIST...

Accuracy and Resolution of Nanoscale Strain Measurement Techniques

March 26, 2013

Author(s)

William A. Osborn, Lawrence H. Friedman, Mark D. Vaudin, Stephan J. Stranick, Michael S. Gaither, Justin M. Gorham, Victor H. Vartanian, Robert F. Cook

Frontiers of Characterization and Metrology for Nanoelectronics: 2013

March 26, 2013

Author(s)

Erik M. Secula, David G. Seiler

Measurement Uncertainties in MEMS Kinematics by Super-Resolution Fluorescence Microscopy

March 25, 2013

Author(s)

Craig D. McGray, Samuel M. Stavis, Jon C. Geist

SCATTERFIELD MICROSCOPY, REVIEW OF TECHNIQUES THAT PUSH THE FUNDAMENTAL LIMITS OF OPTICAL DEFECT METROLOGY

March 25, 2013

Author(s)

Richard M. Silver, Bryan M. Barnes, Francois R. Goasmat, Hui Zhou, Martin Y. Sohn

The semiconductor manufacturing industry is now facing serious challenges in achieving defect detection rates with acceptable throughput and accuracy. With...

Quantitative Characterization and Applications of A 193 nm Scatterfield Microscope

March 25, 2013

Author(s)

Martin Y. Sohn, Bryan M. Barnes, Richard M. Silver

With decreasing feature sizes in semiconductor manufacturing, there is an acute demand for measurements of both critical dimensions (CD) and defects on the...

Charge-Based Capacitance Measurements Circuits for Interface With Atomic Force Microscope Probes

March 25, 2013

Author(s)

Joseph J. Kopanski, Muhammad Y. Afridi, Chong Jiang, Michael Lorek, Timothy Kohler, Curt A. Richter

The charge based capacitance measurement (CBCM) technique is highly sensitive to small capacitances and capable integration of onto an AFM tip, thereby reducing...

Spatially-Resolved Dopant Characterization with a Scanning Microwave Microscope

March 25, 2013

Author(s)

Thomas M. Wallis, Atif A. Imtiaz, Alexandra E. Curtin, Pavel Kabos, Matthew D. Brubaker, Norman A. Sanford, Kristine A. Bertness

The scanning microwave microscope (SMM) is a tool for spatially-resolved microwave characterization of nanoelectronic materials and devices. The microscope...

3-D Optical Metrology of Finite sub-20 nm Dense Arrays using Fourier Domain Normalization

March 25, 2013

Author(s)

Jing Qin, Hui Zhou, Bryan M. Barnes, Ronald G. Dixson, Richard M. Silver

Reduced target dimensions requiring improved resolution and sensitivity have driven the need to use and analyze the phase and scattered frequency information...

Concept Analysis to Enrich Manufacturing Service Capability Models

March 22, 2013

Author(s)

Jun H. Shin, Boonserm Kulvatunyou, Yunsu Lee, Nenad Ivezic

When an Original Equipment Manufacturer (OEM), which makes a final product for the consumer marketplace by purchasing components from its suppliers, faces...

Combinatorial Coverage Measurement Concepts and Applications

March 22, 2013

Author(s)

David R. Kuhn, Itzel (. Dominquez Mendoza, Raghu N. Kacker, Yu Lei

Empirical data demonstrate the value of t-way coverage, but in some testing situations, it is not practical to use covering arrays. However any set of tests...

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