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Conferences

TSV Reveal height and bump dimension metrology by the TSOM method

Author(s)
Ravikiran Attota, Haesung Park, Victor H. Vartanian, Ndubuisi G. Orji, Richard A. Allen
Through-focus scanning optical microscopy (TSOM) transforms conventional optical microscopes into truly 3D metrology tools for nanoscale- to- microscale...

Limits in Modeling Power Grid Topology

Author(s)
Brian D. Cloteaux
Because of their importance to infrastructure, a number of studies have examined the structural properties of power grids and have proposed random topological...

Video-based Face Recognition via Joint Sparse Representation

Author(s)
P J. Phillips, Yi-Chen Chen, Vishal M. Patel, Sumit Shekar, Rama Chellappa
In video-based face recognition, a key challenge is in exploiting the extra information available in a video; e.g., face, body, and motion identity cues. In...

Sustainability through Lifecycle Synthesis of Material Information

Author(s)
Paul W. Witherell, Katherine C. Morris, Anantha Narayanan Narayanan, Jae H. Lee, Sudarsan Rachuri
The synthesis of material information across lifecycle stages will lay the foundation for a material information model to support sustainable decision making...

Gaps Analysis for CD Metrology Beyond the 22 nm Node

Author(s)
Benjamin D. Bunday, Thomas Germer, Victor H. Vartanian, Aaron Cordes, Aron Cepler, Charles Settens
This paper will examine the future for critical dimension (CD) metrology. First we will present the extensive list of applications for which CD metrology...

Dictionary Learning from Ambiguously Labeled Data

Author(s)
P J. Phillips, Yi-Chen Chen, Vishal M. Patel, Jaishanker K. Pillai, Rama Chellappa
We propose a novel dictionary-based learning method for ambiguously labeled multiclass classification, where each training sample has multiple labels and only...

Estimating Uncertainties in Antenna Measurements

Author(s)
Michael H. Francis
We describe general methods of estimating uncertainties in antenna measurements. These include estimates based on theory (analysis1), simulation, and altering...

A Basic CWE-121 Buffer Overflow Effectiveness Test Suite

Author(s)
Paul E. Black, Hsiao-Ming M. Koo, Thomas F. Irish
Phase 3 of MITRE's Common Weakness Enumeration (CWE) Compatibility and Effectiveness program allows a customer to understand how effective a software assurance...

The MEMS 5-in-1 Test Chips (Reference Materials 8096 and 8097)

Author(s)
Janet M. Cassard, Jon C. Geist, Craig D. McGray, Richard A. Allen, Muhammad Y. Afridi, Brian J. Nablo, Michael Gaitan, David G. Seiler
This paper presents an overview of the Microelectromechanical Systems (MEMS) 5-in-1 Reference Material (RM), which is a single test chip with test structures...
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