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Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and
Our objective is the development of Standard Reference Materials ( SRMs) and quantitative, reproducible, and accurate measurement methods for characterization
A new publication describes METIS, a Metrology Exchange to Innovate in Semiconductors We are seeking comments on the draft publication through February 16, 2024
Nanocalorimetry provides a capability to measure the thermal properties of very small samples and at very fast rates. Materials and interfaces of interest
Advanced methods to measure the thermal properties of thin films and interfaces are required to understand and improve microelectronic device fabrication
The work carried out under this project creates a wide variety of X-ray powder diffraction (XRPD) Standard Reference Materials (SRMs) used to calibrate and
The PBD is making new, state-of-the-art measurements of the wavelengths of select atomic X-ray emission lines. These measurements underpin all precision x-ray
This project is tasked with enabling accurate nanomechanical property measurements on materials through calibrations and standards. Our goal is to develop
Mechanical strain impacts the performance of semiconductor devices. Manufacturing processes must be carefully controlled for strain to achieve high-yield and
Our objective is to develop metrology techniques for characterizing mechanical strain in semiconductor devices as well as reference materials for assessing the
The thermal properties of materials and interfaces that govern the performance, reliability, and thermal management in microelectronics packages and wide
Develop critical thermal and electrical transport measurement methods, instrumentation, and reference materials needed to support the development, performance