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Search Publications by: Daniel Josell (Fed)

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Displaying 1 - 25 of 276

Quantifying grating defects in X-ray Talbot-Lau interferometry through a comparative study of two fabrication techniques

April 24, 2025
Author(s)
Alexandre Pereira, Simon Spindler, Zhitian Shi, Lucia Romano, Michal Rawlik, Federica Marone, Martin Stauber, Marco Stampanoni, Daniel Josell
The performance of an X-ray grating interferometry system depends on the geometry and quality of the gratings. Fabrication of micrometer-pitch high-aspect-ratio gold gratings, which are essential for measuring small refraction angles at higher energies, is

Bottom-up Gold Filling of Sub-Micrometer Wide Trenches

April 3, 2025
Author(s)
Daniel Josell, Lucia Romano, Konstantins Jefimovs
A 〖Bi〗^(3+)-stimulated Au electrodeposition process in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes has been previously demonstrated for void-free bottom-up filling of progressively deeper and higher aspect trenches in gratings for

Fabrication of Ultra-Thick Masks for X-ray Phase Contrast Imaging at Higher Energy

February 16, 2025
Author(s)
Daniel Josell, Alessandro Rossi, Sandro Olivo, ioannis Papakonstantinou, Ian Buchanon, Alberto Astolfo, Anton Charman, Daniel Briglin
X-ray phase contrast imaging (XPCI) provides higher sensitivity to low absorbing objects that can be invisible to conventional attenuation-based X-ray imaging. This technique's main application has been so far mostly focused on medical areas at relatively

A Four-Grating Interferometer for X-Ray Multi-Contrast Imaging

March 24, 2024
Author(s)
Daniel Josell, Houxun Miao, James Williams, Jr.
Background: X-Ray multi-contrast imaging with gratings provides a practical method to detect the differential phase and dark-field contrast images in addition to the traditional X-ray absorption image in a laboratory or hospital environment. Systems have

Bottom-up Au Filling of Trenches in Curved Wafers

March 4, 2024
Author(s)
Daniel Josell, Thomas P. Moffat, Thomas Gnaupel-Herold, David Raciti, Martin Stauber, Yu Q, Liyang Chen, M Rawlik, Marco Stampanoni, Lucia Romano
A 〖Bi〗^(3+)-stimulated Au electrodeposition process in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes has been previously demonstrated for void-free extreme bottom-up filling of trenches with aspect ratios (height/width) exceeding 60 in

Implementation of a dual-phase grating 1 interferometer for multi-scale characterization of 2 building materials by tunable dark-field imaging

March 1, 2024
Author(s)
Daniel Josell, Caori Organista, Ruizhi Tang, Zhitian Shi, Konstantins Jefimovs, Lucia Romano, Simon Splindler, Pierre Kibleur, Benjamin Blykers, Marco Stampanoni, Matthieu Boone
The multi-scale characterization of building materials is necessary to understand macroscale mechanical processes, with the goal of developing new, better materials aimed at sustainability. In materials science, imaging methods are often used to

Emission Ghost Imaging: reconstruction with data augmentation

February 1, 2024
Author(s)
Kevin J. Coakley, Heather H. Chen-Mayer, Bruce D. Ravel, Daniel Josell, Nikolai Klimov, Sarah Robinson, Daniel S. Hussey
Ghost Imaging enables 2D reconstruction of an object even though particles transmitted or emitted by the object of interest are detected with a single pixel detector without spatial resolution. This is possible because the incident beam is spatially

Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology

April 20, 2023
Author(s)
Thomas P. Moffat, Trevor Braun, David Raciti, Daniel Josell
CONSPECTUS: State-of-the-art manufacturing of electronics involves the electrodeposition of Cu to form 3-D circuitry of arbitrary complexity. This ranges from nanometers wide interconnects between individual transistors to increasingly large multilevel

Extreme Bottom-up Gold Filling of High Aspect Ratio Features

February 27, 2023
Author(s)
Daniel Josell, Thomas P. Moffat
Where copper interconnects fabricated using superconformal electrodeposition processes have enabled dramatic advances in microelectronics over the last quarter century, gold filled gratings fabricated using superconformal 〖Bi〗^(3+)-mediated bottom-up

Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling

December 30, 2022
Author(s)
Daniel Josell, Trevor Braun, Thomas P. Moffat
The mechanism that underlies 〖Bi〗^(3+)-stimulated extreme bottom-up Au filling of trenches and vias in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes is explored. The remarkable void-free feature filling and self-passivation behavior

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

March 25, 2022
Author(s)
Daniel Josell, William Alexander Osborn, Maureen E. Williams
This work extends application of an extreme variant of superconformal Au electrodeposition to deeper device architectures while exploring factors that constrain its function and thereby the robustness of void-free processing. The unconventional bottom-up

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias

November 2, 2021
Author(s)
Daniel Josell, Thomas P. Moffat, Trevor Braun
The microstructure of copper filled through silicon vias deposited in a CuSO4 + H2SO4 electrolyte containing micromolar concentrations of deposition rate suppressing poloxamine and chloride additives is explored using electron backscatter diffraction
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