Josell, D.
, Wheeler, D.
and Moffat, T.
(2021),
Catalyst Induced Superconformal Filling: Electrodeposition and Chemical Vapor Deposition, Journal of the Materials Research Society
(Accessed May 22, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Catalyst Induced Superconformal Filling: Electrodeposition and Chemical Vapor Deposition
Published
Author(s)
, ,
Abstract
Superconformal filling of fine features by electrodeposition and chemical vapor deposition is explained based on a single model that accounts for increase of local growth velocity with increased coverage of a catalytic species adsorbed on the metal surface. Under appropriately designed experimental conditions, local catalyst coverage at the bottom surfaces of fine features is increased significantly by the local decrease of metal surface area during filling, resulting in superconformal growth. The model is supported by comparison of predicted and experimental results during copper electrodeposition and simulation of recently reported superconformal filling and roughness evolution during iodine-catalyzed chemical vapor deposition of copper.Citation
Journal of the Materials Research Society
Pub Type
Journals
Keywords
Copper, Super Conformal Deposition Catalyst, Superfill
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created October 12, 2021