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Catalyst Induced Superconformal Filling: Electrodeposition and Chemical Vapor Deposition

Published

Author(s)

Daniel Josell, Daniel Wheeler, Thomas P. Moffat

Abstract

Superconformal filling of fine features by electrodeposition and chemical vapor deposition is explained based on a single model that accounts for increase of local growth velocity with increased coverage of a catalytic species adsorbed on the metal surface. Under appropriately designed experimental conditions, local catalyst coverage at the bottom surfaces of fine features is increased significantly by the local decrease of metal surface area during filling, resulting in superconformal growth. The model is supported by comparison of predicted and experimental results during copper electrodeposition and simulation of recently reported superconformal filling and roughness evolution during iodine-catalyzed chemical vapor deposition of copper.
Citation
Journal of the Materials Research Society

Keywords

Copper, Super Conformal Deposition Catalyst, Superfill

Citation

Josell, D. , Wheeler, D. and Moffat, T. (2021), Catalyst Induced Superconformal Filling: Electrodeposition and Chemical Vapor Deposition, Journal of the Materials Research Society (Accessed August 9, 2022)
Created October 12, 2021