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Bottom-up Gold Filling of Sub-Micrometer Wide Trenches
Published
Author(s)
Daniel Josell, Lucia Romano, Konstantins Jefimovs
Abstract
A 〖Bi〗^(3+)-stimulated Au electrodeposition process in slightly alkaline 〖Na〗_3 Au(〖SO〗_3 )_2+〖Na〗_2 〖SO〗_3 electrolytes has been previously demonstrated for void-free bottom-up filling of progressively deeper and higher aspect trenches in gratings for advanced X-ray imaging technologies. The present work extends this bottom-up Au filling phenomenon to improve filling of small trenches. In particular, electrolytes are examined to reduce passive deposition on the sidewalls that makes filling of small, rather than high aspect ratio, features problematic. Improved Au fill in trenches as narrow as 0.5 m in width is detailed.
Josell, D.
, Romano, L.
and Jefimovs, K.
(2025),
Bottom-up Gold Filling of Sub-Micrometer Wide Trenches, Journal of the Electrochemical Society, [online], https://doi.org/10.1149/1945-7111/adc493, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=959494
(Accessed October 9, 2025)