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Search Publications by: Maureen E. Williams (Fed)

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Displaying 26 - 50 of 53

Chapter 7: Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects

March 15, 2016
Author(s)
Nicholas Clore, Dennis D. Fritz, Wei-Hsun Chen, Maureen E. Williams, John E. Blendell, Carol A. Handwerker
This chapter focuses on a study to develop & validate a surface defect counting procedure to be applied in research on the specific mechanisms responsible for stress relaxation & tin whisker formation in tin films. The current JEDEC standards [1,2] for the

gamma-prime Phase Stability and Phase Equilibrium in Ternary Co-W-Al at 900 degC

October 15, 2014
Author(s)
Eric Lass, Maureen E. Williams, Carelyn E. Campbell, Kil-Won Moon, Ursula R. Kattner
Phase equilibria at 900 °C in the Co-rich Co-W-Al ternary system is investigated through isothermal annealing of six alloy compositions for times up to 8000 h. The volume fraction of the L12-gamma-prime phase co-existing with disordered FCC-gamma, B2 and

Atom-Probe Tomographic Study of ?/?' Interfaces and Compositions in an Aged Co-Al-W Superalloy

December 12, 2012
Author(s)
Eric Lass, Kil-Won Moon, Maureen E. Williams, Carelyn E. Campbell, Ursula R. Kattner, David C. Dunand, Peter J. Bocchini, David N. Seidman
Atom-probe tomography (APT) is utilized to investigate, in a Co-9.7Al-10.8W at.% alloy aged at 900 °C for 1000 h, the phase composition and partitioning behavior of the two-phase ɣ(f.c.c.)/ɣ'(L12) microstructure. The APT composition of the ɣ-matrix (Co-8

Interim Report on the Examination of Corrosion Damage in Homes Constructed with Imported Wallboard: Examination of Samples Received September 28, 2009

June 30, 2010
Author(s)
David J. Pitchure, Richard E. Ricker, Maureen E. Williams, Sandra W. Claggett
Since many household systems are fabricated with metallic materials, changes to the household environment that accelerate corrosion will increase the failure rates of these systems. Recently, increased failure rates have been reported in homes constructed

Whisker Formation in Pb-Free Surface Finishes

February 2, 2010
Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn whisker growth in electrodeposits. Altough whiskers appear to be a local response to the

Three-Dimensionally Structured CdTe Thin Film Photovoltaic Devices with Self-Aligned Back Contacts: Electrodeposition on Interdigitated Electrodes.

June 25, 2009
Author(s)
Daniel Josell, Carlos R. Beauchamp, Suyong S. Jung, Behrang H. Hamadani, Abhishek Motayed, Lee J. Richter, Maureen E. Williams, John E. Bonevich, Alexander J. Shapiro, Nikolai B. Zhitenev, Thomas P. Moffat
Cadmium-telluride photovoltaic cells were deposited on substrates patterned with two interdigitated electrodes. Deposition involved application of different potentials to the two electrodes in order to obtain a 3-d gradient of film properties within the

Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic

October 16, 2008
Author(s)
Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To

Equi-Axed Grain Formation in Electrodeposited Sn-Bi

December 29, 2007
Author(s)
E Sandnes, Maureen E. Williams, Mark D. Vaudin, Gery R. Stafford
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion resistance. However, Sn whiskers have been observed to grow spontaneously from Sn electrodeposits and

Electrodeposition of Bismuth From Nitric Acid Electrolyte

April 2, 2007
Author(s)
E Sandnes, Maureen E. Williams, Ugo Bertocci, Mark D. Vaudin, Gery R. Stafford
The electrodeposition of Bi from acidic nitrate solution was examined. Bismuth deposition was determined to be quasi-reversible on Au, with a current efficiency of 100%, based on integration of deposition and stripping voltammetric waves. No interference

Whisker Formation in Pb-Free Surface Finishes

September 11, 2006
Author(s)
Gery R. Stafford, Maureen E. Williams, C E. Johnson, Kil-Won Moon, Ugo Bertocci, William J. Boettinger
High purity bright Sn, Sn-Cu and Sn-Pb layers measuring 3,7 and 16 microns thick were electrodeposited onto phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min. of plating proved that all

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

November 11, 2005
Author(s)
William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of several days, Sn-Cu deposits develop 50 mm contorted hillocks and 200 mm whiskers, pure Sn

Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

September 11, 2005
Author(s)
Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger
To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the

Contribution to the Zn-Rich Part of the Zn-Zr Phase Diagram

August 11, 2004
Author(s)
Maureen E. Williams, William J. Boettinger, Ursula R. Kattner
The reaction of zinc vapor with Zircaloy-4 and nuclear grade zirconium was investigated with various analytical techniques: optical metallography, scanning electron microscopy (SEM), transmission electron microscopy (TEM), and X-ray diffraction. Based on

Whisker Formation on Electroplated Sn-Cu

June 1, 2002
Author(s)
Maureen E. Williams, C E. Johnson, Kil-Won Moon, Gery R. Stafford, C A. Handwerker, William J. Boettinger
The probability of whisker growth on as-deposited tin (Sn) electrodeposits has been measured as a function of copper (Cu superscript2+) addition to a commercial bright methanesulfonate electrolyte. Two substrate materials were used: free standing 250 um

The Formation of Whiskers on Electroplated Tin

December 1, 2001
Author(s)
Kil-Won Moon, Maureen E. Williams, C E. Johnson, Gery R. Stafford, C A. Handwerker, William J. Boettinger
ta is presented on the probability of whisker growth on as-grown tin (Sn) electrodeposits as a function of Cu concentration in the electrolye. A commercial bright methanesulfonate electrolyte was employed at 25 degreesC with copper (Cu) concentrations from

Moving the Pulsed Heating Technique Beyond Monolithic Specimens: Experiments with Coated Wires

August 1, 2001
Author(s)
Daniel Josell, D Basak, J L. McClure, Ursula R. Kattner, Maureen E. Williams, William J. Boettinger, M Rappaz
Pulsed heating experiments based on pyrometric measurement of the temperature-time history of metal specimens rapidly heated by passage of electric current have a thirty year history at NIST. In recent years, efforts have been made to move beyond the

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

Alpha Case Thickness Modeling in Investment Castings

December 1, 2000
Author(s)
William J. Boettinger, Maureen E. Williams, Sam R. Coriell, Ursula R. Kattner, B A. Mueller
The alpha case thickness at the surface of a Ti-6Al-4V step wedge investment casting has been measured and successfully predicted. The prediction uses temperature-time results obtained from a heat flow simulation of the casting that was performed with a