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PUBLICATIONS

Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic

Published

Author(s)

Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell

Abstract

Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To determine if the interfacial IMC is a requirement for whisker growth, bright Sn and a Sn-Cu alloy are electroplated on a tungsten (W) substrate that does not form interfacial IMC with the deposit. At room temperature Sn hillocks grew on pure Sn deposits and Sn whiskers grew from Sn-Cu alloy electrodeposits without an interfacial IMC between the deposits and the W substrates.
Citation
Journal of Electronic Materials
Pub Type
Journals

Keywords

focused ion beam, interfacial intermetallic compound, Sn whiskers

Citation

Williams, M. , Moon, K. , Boettinger, W. and Josell, D. (2008), Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic, Journal of Electronic Materials (Accessed May 31, 2023)

Created October 16, 2008