Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic
Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To determine if the interfacial IMC is a requirement for whisker growth, bright Sn and a Sn-Cu alloy are electroplated on a tungsten (W) substrate that does not form interfacial IMC with the deposit. At room temperature Sn hillocks grew on pure Sn deposits and Sn whiskers grew from Sn-Cu alloy electrodeposits without an interfacial IMC between the deposits and the W substrates.
Journal of Electronic Materials
focused ion beam, interfacial intermetallic compound, Sn whiskers
, Moon, K.
, Boettinger, W.
and Josell, D.
Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic, Journal of Electronic Materials
(Accessed May 31, 2023)