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Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

Published

Author(s)

Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger

Abstract

To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the Auger chanber at 2 x 10(superscript-9)Pa for 9 days and then immediately analyzed by SEM. Two features of the Sn whiskers are observed: whiskers with whisker-shaped shadows and whiskers without shadows. Whiskers with shawdows existed prior to cleaning, and whiskers without shadows grew after cleaning. Based on this observation, the presence or absence of oxide film does not affect Sn whisker growth.
Citation
Journal of Electronic Materials
Volume
34
Issue
9

Keywords

Auger, electrodeposition, lead-free solder, Sn whisker, surface oxide film

Citation

Moon, K. , Johnson, C. , Williams, M. , Kongstein, O. , Stafford, G. , Handwerker, C. and Boettinger, W. (2005), Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders, Journal of Electronic Materials, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853271 (Accessed February 24, 2024)
Created September 11, 2005, Updated February 17, 2017