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Search Publications by: Maureen E. Williams (Fed)

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Displaying 51 - 75 of 106

Chapter 7: Quantitative Assessment of Stress Relaxation in Tin Films by the Formation of Whiskers, Hillocks, and Other Surface Defects

March 15, 2016
Author(s)
Nicholas Clore, Dennis D. Fritz, Wei-Hsun Chen, Maureen E. Williams, John E. Blendell, Carol A. Handwerker
This chapter focuses on a study to develop & validate a surface defect counting procedure to be applied in research on the specific mechanisms responsible for stress relaxation & tin whisker formation in tin films. The current JEDEC standards [1,2] for the

gamma-prime Phase Stability and Phase Equilibrium in Ternary Co-W-Al at 900 degC

October 15, 2014
Author(s)
Eric Lass, Maureen E. Williams, Carelyn E. Campbell, Kil-Won Moon, Ursula R. Kattner
Phase equilibria at 900 °C in the Co-rich Co-W-Al ternary system is investigated through isothermal annealing of six alloy compositions for times up to 8000 h. The volume fraction of the L12-gamma-prime phase co-existing with disordered FCC-gamma, B2 and

Atom-Probe Tomographic Study of ?/?' Interfaces and Compositions in an Aged Co-Al-W Superalloy

December 12, 2012
Author(s)
Eric Lass, Kil-Won Moon, Maureen E. Williams, Carelyn E. Campbell, Ursula R. Kattner, David C. Dunand, Peter J. Bocchini, David N. Seidman
Atom-probe tomography (APT) is utilized to investigate, in a Co-9.7Al-10.8W at.% alloy aged at 900 °C for 1000 h, the phase composition and partitioning behavior of the two-phase ɣ(f.c.c.)/ɣ'(L12) microstructure. The APT composition of the ɣ-matrix (Co-8

Interim Report on the Examination of Corrosion Damage in Homes Constructed with Imported Wallboard: Examination of Samples Received September 28, 2009

June 30, 2010
Author(s)
David J. Pitchure, Richard E. Ricker, Maureen E. Williams, Sandra W. Claggett
Since many household systems are fabricated with metallic materials, changes to the household environment that accelerate corrosion will increase the failure rates of these systems. Recently, increased failure rates have been reported in homes constructed

Whisker Formation in Pb-Free Surface Finishes

February 2, 2010
Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn whisker growth in electrodeposits. Altough whiskers appear to be a local response to the

Three-Dimensionally Structured CdTe Thin Film Photovoltaic Devices with Self-Aligned Back Contacts: Electrodeposition on Interdigitated Electrodes.

June 25, 2009
Author(s)
Daniel Josell, Carlos R. Beauchamp, Suyong S. Jung, Behrang H. Hamadani, Abhishek Motayed, Lee J. Richter, Maureen E. Williams, John E. Bonevich, Alexander J. Shapiro, Nikolai B. Zhitenev, Thomas P. Moffat
Cadmium-telluride photovoltaic cells were deposited on substrates patterned with two interdigitated electrodes. Deposition involved application of different potentials to the two electrodes in order to obtain a 3-d gradient of film properties within the

Examination of Sn Electrodeposit on a Substrate Not Forming Intermetallic

October 16, 2008
Author(s)
Maureen E. Williams, Kil-Won Moon, William J. Boettinger, Daniel Josell
Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to produce compressive stress in Sn electrodeposits and cause the growth of Sn whiskers. To

Equi-Axed Grain Formation in Electrodeposited Sn-Bi

December 29, 2007
Author(s)
E Sandnes, Maureen E. Williams, Mark D. Vaudin, Gery R. Stafford
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion resistance. However, Sn whiskers have been observed to grow spontaneously from Sn electrodeposits and
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