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Search Publications by: John S. Villarrubia (Fed)

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Displaying 26 - 50 of 213

Uncertainties in Nanometer-Scale Dimensional Metrology

July 1, 2016
Author(s)
John S. Villarrubia
These are slides used for an oral presentation made at the NIST "Workshop on Quantification of Uncertainties in Material Science." In nanometer-scale dimensional metrology, correction of probing errors, which are caused by the characteristic left/right

Virtual rough samples to test 3D nanometer-scale SEM stereo photogrammetry

March 22, 2016
Author(s)
John S. Villarrubia, Vipin N. Tondare, Andras Vladar
The combination of SEM for high spatial resolution, images from multiple angles to provide 3D information, and commercially available stereo photogrammetry software for 3D reconstruction offers promise for dimensional metrology in 3D. A method is described

Optimizing Hybrid Metrology: Rigorous Implementation of Bayesian and Combined Regression.

November 12, 2015
Author(s)
Mark Alexander Henn, Richard M. Silver, John S. Villarrubia, Nien F. Zhang, Hui Zhou, Bryan M. Barnes, Andras Vladar, Bin Ming
Hybrid metrology, e.g. the combination of several measurement techniques to determine critical dimensions, is an important approach to meet the needs of semiconductor industry. A proper use of hybrid metrology may not only yield more reliable estimates for

Scanning electron microscope measurement of width and shape of 10 nm patterned lines using a JMONSEL-modeled library

July 1, 2015
Author(s)
John S. Villarrubia, Andras Vladar, Bin Ming, Regis J. Kline, Daniel F. Sunday, Jasmeet Chawla, Scott List
The width and shape of 10 nm to 12 nm wide lithographically patterned SiO2 lines were measured in the scanning electron microscope by fitting the measured intensity vs. position to a physics-based model in which the lines’ widths and shapes are parameters

Optimizing Hybrid Metrology: Rigorous Implementation of Bayesian and Combined Regression

March 19, 2015
Author(s)
Mark Alexander Henn, Richard M. Silver, Nien F. Zhang, Hui Zhou, Bryan M. Barnes, Bin Ming, Andras Vladar, John S. Villarrubia
Hybrid metrology, e.g. the combination of several measurement techniques to determine critical dimensions, is an important approach to meet the needs of semiconductor industry. A proper use of hybrid metrology may not only yield more reliable estimates for

New Insights into Subsurface Imaging of Carbon Nanotubes in Polymer Composites via Scanning Electron Microscopy

February 4, 2015
Author(s)
Minhua Zhao, Bin Ming, Jae-Woo Kim, Luke J. Gibbons, Xiaohong Gu, Tinh Nguyen, Cheol Park, Peter T. Lillehei, John S. Villarrubia, Andras Vladar, James A. Liddle
Despite many studies of subsurface imaging of carbon nanotube (CNT)-polymer composites via scanning electron microscopy (SEM), significant controversy exists concerning the imaging depth and contrast mechanisms. We studied CNT-polyimide composites and, by

3D Monte Carlo modeling of the SEM: Are there applications to photomask metrology?

October 23, 2014
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
The ability to model the effect of fields due to charges trapped in insulators with floating conductors has been added to JMONSEL (Java Monte Carlo simulator for Secondary Electrons) and applied to a simple photomask metal on glass geometry. These

Optimizing Hybrid Metrology through a Consistent Multi-Tool Parameter Set and Uncertainty Model

April 14, 2014
Author(s)
Richard M. Silver, Bryan Barnes, Nien F. Zhang, Hui Zhou, Andras Vladar, John S. Villarrubia, Regis J. Kline, Daniel Sunday, Alok Vaid
There has been significant interest in hybrid metrology as a novel method for reducing overall measurement uncertainty and optimizing measurement throughput (speed) through rigorous combinations of two or more different measurement techniques into a single

10 nm Three-Dimensional CD-SEM Metrology

April 10, 2014
Author(s)
Andras Vladar, John S. Villarrubia, Bin Ming, Regis J. Kline, Jasmeet Chawla, Scott List, Michael T. Postek
The shape and dimensions of a challenging pattern have been measured using a model-based library scanning electron microscope (MBL SEM) technique. The sample consisted of a 4-line repeating pattern. Lines were narrow (10 nm), asymmetric (different edge

The Effect of Tip Size in Calibration of Surface Roughness Specimens with Rectangular Profiles

September 2, 2013
Author(s)
Jun-Feng Song, Thomas B. Renegar, Johannes A. Soons, Balasubramanian Muralikrishnan, John S. Villarrubia, Xiaoyu A. Zheng, Theodore V. Vorburger
For the calibration of rectangular and trapezoidal profile roughness specimens, stylus tip will increase profile peak width and decrease valley width, which may cause the Ra changes (either increase or decrease, depends on the profile shape). Sometimes the