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Search Publications by: Gery R. Stafford (Assoc)

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Displaying 51 - 75 of 75

Whisker Formation in Pb-Free Surface Finishes

September 11, 2006
Author(s)
Gery R. Stafford, Maureen E. Williams, C E. Johnson, Kil-Won Moon, Ugo Bertocci, William J. Boettinger
High purity bright Sn, Sn-Cu and Sn-Pb layers measuring 3,7 and 16 microns thick were electrodeposited onto phosphor bronze cantilever beams in a rotating disk apparatus. Beam deflection measurements within 15 min. of plating proved that all

Whisker & Hillock Formation on Sn, Sn-Cu and Sn-Pb Electrodeposits

November 11, 2005
Author(s)
William J. Boettinger, C E. Johnson, Leonid A. Bendersky, Kil-Won Moon, Maureen E. Williams, Gery R. Stafford
Bright Sn, Sn-Cu and Sn-Pb layers, 3, 7 and 16 mm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus. Over a period of several days, Sn-Cu deposits develop 50 mm contorted hillocks and 200 mm whiskers, pure Sn

In Situ Stress Measurements During Copper Electrodeposition on (111)-Textured Au

October 1, 2005
Author(s)
Gery R. Stafford, O E. Kongstein, Carlos R. Beauchamp
In situ stress measurements were made during copper electrodeposition onto (111)-textured Au from acidic sulfate electrolyte using the wafer curvature method. In the Cu upd region, the intermediate honeycomb structure where sulfate form an ordered ((surd

Observed Correlation of Sn Oxide film to Sn Whisker Growth in Sn-Cu electrodeposit for pb-free Solders

September 11, 2005
Author(s)
Kil-Won Moon, C E. Johnson, Maureen E. Williams, O Kongstein, Gery R. Stafford, C A. Handwerker, William J. Boettinger
To evaluate the effects of the oxide film on Sn whisker growth, a bright Sn-Cu electrodeposit was tested in an ultrahigh vacuum chamber with Auger analysis. After Ar+ ion beam cleaning to remove the oxide film, the sample was analyzed and stored in the

Order/Disorder in Electrodeposited Aluminum-Titanium Alloys

July 1, 2003
Author(s)
Gery R. Stafford, T Tsuda, C L. Hussey
The composition, morphology, and crystallographic microstructure of Al-Ti alloys electrodeposited from two Different chloroaluminate molten salt electrolytes were examined. Alloys containing up to 28% atomic fraction Ti were electrodeposited at 150 oC from

Superconformal Electrodeposition of Silver in Submicrometer Features

August 1, 2002
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell
The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide

Whisker Formation on Electroplated Sn-Cu

June 1, 2002
Author(s)
Maureen E. Williams, C E. Johnson, Kil-Won Moon, Gery R. Stafford, C A. Handwerker, William J. Boettinger
The probability of whisker growth on as-deposited tin (Sn) electrodeposits has been measured as a function of copper (Cu superscript2+) addition to a commercial bright methanesulfonate electrolyte. Two substrate materials were used: free standing 250 um

The Formation of Whiskers on Electroplated Tin

December 1, 2001
Author(s)
Kil-Won Moon, Maureen E. Williams, C E. Johnson, Gery R. Stafford, C A. Handwerker, William J. Boettinger
ta is presented on the probability of whisker growth on as-grown tin (Sn) electrodeposits as a function of Cu concentration in the electrolye. A commercial bright methanesulfonate electrolyte was employed at 25 degreesC with copper (Cu) concentrations from

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

Cu Electrodeposition for On-Chip Interconnections

January 1, 2001
Author(s)
Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the

Sum Frequency Spectroscopy Studies of Adsorption of Additives on Metal/Electrolyte Interfaces

November 1, 2000
Author(s)
Clayton S. Yang, Lee J. Richter, Kimberly Briggman, John C. Stephenson, Thomas P. Moffat, Gery R. Stafford
In situ and ex situ VR-SFG studies of mercaptopropylsulfonate (MPSA) molecules adsorbed on metal/electrolyte interfaces prove the molecular conformation is sensitive to hydration. MPSA catalyses electrodeposition of copper interconnection for semiconductor

Cyclic Voltammetry on Ag(111) and Ag(100) Faces in Sodium Hydroxide Solutions

June 1, 1999
Author(s)
B M. Jovic, V D. Jovic, Gery R. Stafford
The electrochemical behavior of silver (100) and (111) single crystal surfaces was examined in aqueous NaOH solution. The first step of silver oxidation is the electrosorption of OH- ions followed by phase transformation into a monolayer. The difference in