Thermal Transport Through Thin Films: Mirage Technique Measurements on Aluminum/Titanium Multilayers

Published

March 1, 2000

Author(s)

E J. Gonzalez, John E. Bonevich, Gery R. Stafford, Grady S. White, Daniel Josell

Abstract

Thermal transport properties of multilayer thin films both normal and parallel to the layers were measured. Al/Ti multilayer films 3 m thick, with individual layers systematically varied from 2.5 to 40 nm, were studied on Si substrates. Layers ofAl and Ti were nominally equal in thickness, with actual composition determined for each specimen using energy dispersive spectroscopy. The thermal diffusivity both in the plane of the films (thermal conductivity divided by specific heat per volume) was found to decrease significantly with decreasing bilayer thickness. Pure Ti and Al films as well as Cu films from 0.1 to 5 m thick were also studied. In-plane electrical conductances of the Al/Ti multilayers were also measured.

Citation

Journal of Materials Research

Volume

15

Issue

No. 3

Pub Type

Journals

Download Paper

Local Download

Keywords

aluminum, copper, mirage technique, multilayers, thermal conductivity, thermal diffusion, thin film, titanium

Citation

Gonzalez, E. , Bonevich, J. , Stafford, G. , White, G. and Josell, D. (2000), Thermal Transport Through Thin Films: Mirage Technique Measurements on Aluminum/Titanium Multilayers, Journal of Materials Research, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=850345 (Accessed October 9, 2025)