NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Electrodeposition of Cu-Al Alloys and Underpotential Deposition of Al onto Cu Single Crystals from a Room-Temperature Chloroaluminate Molten Salt
Published
Author(s)
Gery R. Stafford, V D. Jovic, C L. Hussey
Abstract
The electrodeposition of Cu-Al alloys, as well as underpotential deposition (UPD) of Al onto Cu(111), Cu(100) and Cu(110) faces, were investigated in the Lewis acidic aluminum chloride/1-methyl-3-ethyl-imidazolium chloride. It was shown that it is possible to produce Cu-Al alloy deposits at potentials positive of that corresponding to the electrodeposition of bulk Al ({approximately equal to} 0.V). For a 0.05 mol dm-3 solution of Cu(1), the onset of the Al codeposition process was found to occur at around 0.30 V versus the Al(111)/Al couple; however, a limiting current for the reduction of Cu(1) to pure Cu metal can be observed in the 0.60 V to 0.30 V potential interval in this solution. The Cu-Al alloy composition was found to be independent of the Cu(1) concentration, reaching a maximum value of 43 atomic percent (a/o) Al at 0 V. X-ray diffraction studies induicated that Cu-Al deposits containing about 7.2 a/o Al retained the fcc Cu structure; however, deposits containing 12.8 a/o Al were two-phase with the second phase tentaively indentified as martensitic Β'-Cu3Al. This phase appears to form before fcc Cu becomes saturated with Al. Cyclic voltammograms recorded onto Cu(111), Cu(100) and Cu(110) clearly indicate that UPD of Al commences at about 0.3 V vs. Al. On the (111) face of Cu UPD takes place through two sharp and separated peaks, indicating formation of two different adsorbed structures, with the second peak corresponding to the formation of a monolayer of Al. Surface alloying of Cu with Al was detected at potentials of the first peak ({approximately equal to} 0.25 V vs. Al).
Cu-Al, electrodeposition, molten salt, phase composition, room temperature, UPD of Al
Citation
Stafford, G.
, Jovic, V.
and Hussey, C.
(2000),
Electrodeposition of Cu-Al Alloys and Underpotential Deposition of Al onto Cu Single Crystals from a Room-Temperature Chloroaluminate Molten Salt, Advanced Materials Research, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852958
(Accessed October 10, 2025)