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Displaying 32301 - 32325 of 73830

Semiconductor Microelectronics and Nanoelectronics Programs

July 2, 2007
Author(s)
Stephen Knight, Joaquin (. Martinez, Michele L. Buckley
The microelectronics industry supplies vital components to the electronics industry and to the U.S. economy, enabling rapid improvements in productivity and in new high technology growth industries such as electronic commerce and biotechnology. The

A Pilot Implementation of the Core Manufacturing Simulation Data Information Model

July 1, 2007
Author(s)
Yung-Tsun T. Lee, Swee K. Leong, Frank H. Riddick, Marcus Johansson, Bjoern J. Johansson
Interoperability between manufacturing software applications and simulation is currently extremely limited, and it has been recognized that there is a great need for methods to improve interoperability. The Core Manufacturing Simulation Data (CMSD)

A Test Implementation of the Core Manufacturing Simulation Data Specification

July 1, 2007
Author(s)
Marcus Johansson, Swee K. Leong, Yung-Tsun T. Lee, Frank H. Riddick, Guodong Shao, Bjoern J. Johansson, Anders Skoogh, P Klingstam
This paper describes an effort of testing the Core Manufacturing Simulation Data (CMSD) information model as a neutral data interface for a discrete event simulation model developed using Enterprise Dynamics. The implementation is based upon a model of a

Air Blast Loading of Cellular Media

July 1, 2007
Author(s)
George A. Gazonas, Joseph Main
Motivated by recent efforts to mitigate blast loading using energy-absorbing materials, this paper investigates the mechanics of uniaxial crushing of cellular sandwich plates under air blast loading using analytical and computational modeling. This model

An Ontology for Assembly Representation

July 1, 2007
Author(s)
Xenia Fiorentini, Iacopo Gambino, V.C. Liang, Sebti Foufou, Sudarsan Rachuri, Mahesh Mani, Conrad E. Bock
Mechanical assemblies are systems composed of modules that are either subassemblies or parts. Traditionally an assembly information model contains information regarding parts, their relationships, and its form. But it is important that the model also

Collaborative Augmented Reality for Better Standards

July 1, 2007
Author(s)
Matthew L. Aronoff, John V. Messina
Concurrent engineering depends on clear communication between all members of the development process. As that communication becomes more and more complex, the quality of the standards used to move and understand that information likewise becomes more and

Data Exchange of Parametric CAD Models Using ISO 10303-108

July 1, 2007
Author(s)
Junhwan Kim, Mike Pratt, Raj G. Iyer, Ram D. Sriram
Modern CAD systems generate feature-based product shape models with parameterization and constraints. Until recently, standards for CAD data exchange among different CAD systems were restricted to the exchange of pure shape information. These standards

Distributed Simulation for Interoperability Testing Along the Supply Chain

July 1, 2007
Author(s)
Sanjay Jain, Frank H. Riddick, Andreas Craens, Deogratias Kibira
The need for interoperability of information systems among supply chain partners has been recognized. A number of standards have been or are being developed to ensure interoperability of applications used along the sup-ply chain. An associated need for

Energy-Level Alignment and Work Function Shifts for Thiol-Bound Monolayers of Conjugated Molecules Self-Assembled on Ag, Cu, Au, and Pt

July 1, 2007
Author(s)
Christopher D. Zangmeister, Laura B. Picraux, Roger D. van Zee, Yuxing Yao, J M. Tour
Photoemission spectra have been used to determine the energy-level alignment and work function of monolayers of 4,4'-bis-(phenylethynyl)benzenethiol, 2 naphthalene thiol, and 3-(naphthalen-2-yl)propane-1-thiol self-assembled on Ag, Cu, Au, and Pt. For each

Environmental Regulations Impose New Product Lifecycle Information Requirements

July 1, 2007
Author(s)
John V. Messina, Eric D. Simmon, Matthew L. Aronoff
In a global response to increasing health and environmental concerns, there has been a trend towards governments enacting legislation to encourage sustainable manufacturing where industry creates products that minimize environmental impact. This

Extracting Electron Densities in N-Type GaAs from Raman Spectra: Theory

July 1, 2007
Author(s)
Herbert S. Bennett
Raman measurements are proposed as a non-destructive method for wafer acceptance tests of carrier density. The interpretation of Raman spectra to determine the majority electron density in n-type semiconductors requires an interdisciplinary effort

Field-free ringing of nanomagnets

July 1, 2007
Author(s)
Thomas J. Silva
Ever since William Gilbert's 16th century treatise "De Magnete," it has been known that magnetic fields can be used to manipulate the magnetic orientation of ferromagnets. This has been the foundation for electronic applications of magnetic materials for

Generic Simulation of Automotive Assembly for Interoperability Testing

July 1, 2007
Author(s)
Deogratias Kibira, Charles R. McLean
Computer simulation is effective in improving the effi-ciency of manufacturing system design, operation, and maintenance. Most simulation models are usually tailored to address a narrow set of industrial issues, e.g., the intro-duction of a new product. If

Implementing a Multiplexed System of Detectors for Higher Photon Counting Rates

July 1, 2007
Author(s)
V Schettini, Sergey Polyakov, Ivo P. Degiovanni, Giorgio Brida, Stefania Castelletto, Alan L. Migdall
Photon counting applications are often limited by detector deadtime to operate at count rates of a few MHz, at best, and often at significantly lower levels. This limitation is becoming more critical as with the advance of photon counting applications such

Interpolation Procedures for Database-Assisted Design

July 1, 2007
Author(s)
Joseph A. Main
Database-assisted design (DAD) is a methodology of designing structures for wind loads that makes direct use of pressure time series from wind tunnel tests. This paper presents interpolation procedures that enable application of the DAD approach for cases
Displaying 32301 - 32325 of 73830
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