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Preliminary Hard X-ray Micro-spectroscopic investigations on Thin-Film Ta-and-W Based Diffusion Barriers for Copper Interconnect Technology

Published

Author(s)

J Ablett, Joseph Woicik, Zs Tokei
Proceedings Title
Synchrotron Radiation Instrumentation: Ninth International Conference 879
Conference Location
, 1
Conference Title
sponsored by PAL/JASRI pages: 1557-1560

Citation

Ablett, J. , Woicik, J. and Tokei, Z. (2007), Preliminary Hard X-ray Micro-spectroscopic investigations on Thin-Film Ta-and-W Based Diffusion Barriers for Copper Interconnect Technology, Synchrotron Radiation Instrumentation: Ninth International Conference 879 , , 1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=854334 (Accessed March 4, 2024)
Created September 30, 2007, Updated October 12, 2021