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Displaying 29651 - 29675 of 74855

Letter to the Editor Creep of Consolidated Silver

October 16, 2008
Author(s)
H J. Mueller, F Eichmiller
This letter to the editor is in regard to a recent publication (Indentation Creep Behavior of a Direct-filling Alternative to Amalgam by H.H.K. Xu, H. Liao, and F.C. Eichmiller, J. Dent. Res. 77:1991, 1998), whereby the authors overlooked the citation of a

Limits on Toughening in Structural Adhesives

October 16, 2008
Author(s)
Donald L. Hunston, H Jianmei, R Raghavan, D Hoffman
The addition of a toughener to a thermoset resin, usually an epoxy, can increase the fracture energy by an order of magnitude or more. These materials are two phase systems with small toughener particles in a thermoset matrix. The fracture behavior depends

Long-Term Carrier-Envelope Phase Conherence Achieved

October 16, 2008
Author(s)
S T. Cundiff
NIST researchers have reported a significant extension of the laser technology being developed for optical frequency metrology and optical atomic clocks. While frequency-domain stabilization had heretofore been the chief concern, there are additional

Major International Lead (Pd)-Free Solder Studies

October 16, 2008
Author(s)
C A. Handwerker, E E. de Kluizenaar, K Suganuma, Frank W. Gayle
Beginning in 1991, the microelectronics community worldwide became increasingly aware of the possibility of being required, by law, by tax, or by market pressure, to replace tin-lead eutectic solders in electronic assemblies. Over the ten years that

Mapping Oxidative DNA Damage at Nucleotide Resolution in Mammalian Cells

October 16, 2008
Author(s)
H Rodriguez, T R. O'Connor, H H. Chen, S M. Dai, S D. Flanagan, G P. Holmquist, S A. Akman, A D. Riggs
Analytical techniques including mass spectrometry have proven invaluable for the detection of DNA adducts, but these methods do not map the squence context dependent distribution of adducts. The adduct maps are important to understanding the formation of

Materials Processing in the Advanced Technology Program

October 16, 2008
Author(s)
Clare M. Allocca
The NIST Advanced Technology Program is a unique partnership between government and private industry to accelerate the development of high-risk technologies that promise significant commercial payoffs and widespread benefits for the economy. The ATP

MCMC in StRD

October 16, 2008
Author(s)
Hung-Kung Liu, William F. Guthrie, D Malec, Grace L. Yang
The numerical inaccuracies caused by floating point arithmetic, although often not important, can change the conclusions of an analysis. Computational accuracy is of increasing concern because the number of software packages has exploded as computers have

Measurement of Slippage Induced by a Polymer Processing Additive

October 16, 2008
Author(s)
Kalman Migler, C L. Gettinger, V P. Thlacker, R Conway
Flow profiles of a linear density polyethylene (LLDPE) were measured in an optical slit die situated at the exit of a twin screw extruder. The velocities of tracer particles were measured as a function of position across the slit die at various flow rates

Measurement Performance of High-Accuracy Low-Pressure Transducers

October 16, 2008
Author(s)
A P. Miiller
A systematic study of measurement performance is described for several different types of transducers including capacitance diaphragm gauges (CDGs), quartz Bourdon gauges (QBGs), quartz resonant gauges (QRGs), and two types of MEMS (MicroElectroMechanical
Displaying 29651 - 29675 of 74855