Materials Characterization of Thin Films of Epoxide Functionalized Silsesquioxanes as Potential Underfill Encapsulants

Published

October 16, 2008

Author(s)

Eric K. Lin, Wen-Li Wu, C X. Zhang, R M. Laine

Abstract

Current underfill materials generally consist of an epoxy resin filled withsilica particles and are designed to reduce stresses arising from the difference in the thermal expansion between the silicon die and the substrate. Currently, concerns about the flow of the silica particles and surface phenomena are arising as electronics packages reduce in size. Newly developed epoxide functionalized octameric silsesquioxanes provide an intriguing alternative to current formulations. These single-phase inorganic/organic hybrid materials mayhave the properties of filled materials without the concerns arising from the filler particle size distributions. The physical properties of functionalized silsesquioxanes cured with model curing agents are measured with respect to the critical parameters for underfillmaterials. Measurements of properties such as the coefficient of thermal expansion, the amount of water absorption, and density are performed to partially evaluate the suitability of these materials as potential underfill encapsulants.

Citation

Advanced Packaging Materials

Pub Type

Journals

Keywords

inorganic/organic hybrid, silsesquioxane, thermal expansion, underfil, x-ray reflectivity

Citation

Lin, E. , Wu, W. , Zhang, C. and Laine, R. (2008), Materials Characterization of Thin Films of Epoxide Functionalized Silsesquioxanes as Potential Underfill Encapsulants, Advanced Packaging Materials (Accessed October 15, 2025)