Major International Lead (Pd)-Free Solder Studies

Published

October 16, 2008

Author(s)

C A. Handwerker, E E. de Kluizenaar, K Suganuma, Frank W. Gayle

Abstract

Beginning in 1991, the microelectronics community worldwide became increasingly aware of the possibility of being required, by law, by tax, or by market pressure, to replace tin-lead eutectic solders in electronic assemblies. Over the ten years that followed, separate groups formed in the United States, Europe, and Japan to examine solder-based alternatives to tin-lead eutectic solder and to understand the implications of such a change before it becomes necessary. The following studies are featured in this chapter: the NCMS Lead-Free Solder Project and the NCMS High Temperature Fatigue Resistant Solder Project from the US, the JIEP and JEIDA projects from Japan, and the IDEALS Lead-Free Solder Project from the European Union (EU). Based on these studies, the microelectronics community gained sufficient experience with the performance of lead-free solders to begin addressing lead-free assembly to assess lead-free issues, including manufacturing yield, process windows for complex boards, and component survivability.

Citation

McGraw Hill Issues and Implementation of Pb Free Technology in Microelectronics

Pub Type

Journals

Keywords

alloys, lead-free, microelectronics, processing, reliability, solders

Citation

Handwerker, C. , de Kluizenaar, E. , Suganuma, K. and Gayle, F. (2008), Major International Lead (Pd)-Free Solder Studies, McGraw Hill Issues and Implementation of Pb Free Technology in Microelectronics (Accessed December 15, 2024)