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Metrology

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Displaying 2101 - 2125 of 2718

Tri-Alpha-Napthyl Benzene as a Crystalline or Glassy MALDI Matrix

April 19, 2002
Author(s)
Barry J. Bauer, Charles M. Guttman, Da-Wei Liu, William R. Blair
Tri-alpha-napthyl benzene (TANB) is used as a matrix in matrix-assisted laser desorption/ionization (MALDI) spectroscopy. Electrosprayed TANB is crystalline and has a melting point of 180 2 C. A glass of TANB is obtained with a glass transition temperature

In the Rough

March 1, 2002
Author(s)
Theodore V. Vorburger, Joseph Fu, N G. Orji
Surface roughness affects the function of a wide variety of engineering components, including airport runways, highways, ship hulls and mechanical parts. Perhaps the most demanding applications are in the optics and semiconductor industries. Surface

Handbook of Reference Data for Nondestructive Testing: Ultrasonics Chapter

February 14, 2002
Author(s)
John A. Slotwinski
The ASTM Handbook of Reference Data for Nondestructive Testing (NDT) is a collection of previously available NDT data for use by NDT practitioners. It is intended to be a ready reference guide, and will include chapters on several of the different NDT

A Laser Tracker Calibration System

January 1, 2002
Author(s)
Daniel S. Sawyer, Bruce R. Borchardt, Steven D. Phillips, Charles Fronczek, William T. Estler
We describe a laser tracker calibration system developed for frameless coordinate metrology systems. The system employs a laser rail to provide an 'in situ' calibrated length standard that is used to test a tracker in several different configurations. The

Characterizing CDSEM Metrology of 193 nm Resists at Ultra Low Voltage

January 1, 2002
Author(s)
N. Sullivan, M Mastovich, Ronald G. Dixson, P Knutruda, B Bunday, P Febrea, R Brandoma
Resist slimming under electron beam exposure introduces significant measurement uncertainty in the metrology of 193 nm resists. Total uncertainties, which approach 10 nm, can be realized through the combination of across wafer variation of line slimming

Deformation of Gauge Blocks

January 1, 2002
Author(s)
Theodore D. Doiron, Eric S. Stanfield, Dennis S. Everett
When a force is exerted on any material, the material deforms. Most of the time the effect is small and is neglected. In the measurement of gauge blocks, where the uncertainty goal is stated in nanometers, the deformation is a very large effect, and can be

Large-Scale Metrology - An Update

January 1, 2002
Author(s)
William T. Estler, K L. Edmundson, G Peggs, D H. Parker
Developments in large-scale engineering metrology since the 1978 report of Puttock are reviewed. Advances in optical technology and fast, low-cost computation have led to wide-spread use of laser trackers and digital photogrammetry for general-purpose

NIST Electrostatic Force Balance Experiment

January 1, 2002
Author(s)
John A. Kramar, David B. Newell, Jon R. Pratt
We have designed and built a prototype electrostatic force balance for realizing forces in the micronewton range. The active electrodes are concentric cylinders, the outer serving as the reference and the inner suspended and guided by a rectilinear flexure

Optical Reflectance of Metallic Coatings: Effect of Aluminum Flake Orientation

January 1, 2002
Author(s)
B Laurenti, Egon Marx, Maria Nadal, M E. McKnight, L Sung
The orientation of platelet-like pigments in coatings is affected by the processing conditions resulting in appearance variations of the final product. A set of aluminum-flake pigmented coatings having different flake orientations was pre-pared using

Power Spectral Densities: A Multiple Technique Study of Different Si Wafer Surfaces

January 1, 2002
Author(s)
Egon Marx, I J. Malik, T Bristow, N Poduje, J C. Stover, Y Strausser, M J. Weber
The power spectral density (PSD) formalism is used to characterize a set of surfaces over a wide range of lateral (in-plane, x?y) as well as vertical (out-of-plane, z) dimensions. Twelve 200?mm-diameter Si wafers were prepared; the surface finish ranged

Progress in Developing NIST Standard Casings

January 1, 2002
Author(s)
Jun-Feng Song, Theodore V. Vorburger, M Ols
Standard casings and bullets are currently under development to support the National Integrated Ballistics information Network (NIBIN). The master casings are obtained from the ATF''s National Laboratory Center at Rockville, MD, by a standardized shooting

Scattering by a Dielectric Wedge for Oblique Incidence

January 1, 2002
Author(s)
Egon Marx
Electromagnetic scattering of an incident plane monochromatic wave by dielectric or finitely conducting infinite cylinders of arbitrary cross section can be reduced to the solution of scalar Helmholtz equations in two dimensions for the components of the

Silicon Nanostructures Fabricated by Scanning Probe Lithography and TMAH Etching

January 1, 2002
Author(s)
F S. Chien, W F. Hsieh, S Gwo, Andras Vladar, John A. Dagata
Fabrication of silicon nanostructures is a key technique for the development of monolithically integrated optoelectronic circuits. We demonstrate that the process of scanning probe lithography (SPL) and anisotropic TMAH etching is a low-cost and reliable

The Challenges of Nanometrology

January 1, 2002
Author(s)
Michael T. Postek
The promise and challenge of nanotechnology is immense. The National Nanotechnology Initiative provides an opportunity to develop a new technological base for U.S. Industry. Nanometrology is the basis of the new measurement methods that must be developed

Toward Traceability for At Line AFM Dimensional Metrology

January 1, 2002
Author(s)
Ronald G. Dixson, Angela Guerry, Marylyn H. Bennett, Theodore V. Vorburger, Michael T. Postek
The in-line and at-line measurement tools for critical dimension (CD) metrology in semiconductor manufacturing are technologically advanced instruments that exhibit excellent measurement repeatability--below 1 nm in some cases. Accuracy, however, is

Video-Based Metrology

January 1, 2002
Author(s)
Theodore D. Doiron, Marilyn N. Abrams, Tsai Hong Hong, Michael O. Shneier
With the rapid growth of video-based measurement and inspection systems, we would like to determine the extent to which industry needs calibration artifacts and standardized methods for video metrology. We hope to open a dialog among users for discussing

Video-Based Metrology

January 1, 2002
Author(s)
Theodore D. Doiron, John R. Stoup, Marilyn N. Abrams, Tsai Hong Hong
Video cameras are increasingly used to make dimensional measurements. Many of these systems use interpolation of the pixel data, with some systems claiming to find edges with precision of l/100 of a pixel. We have studied the response of single pixels of a

Critical Dimension Metrology and the Scanning Electron Microscope

December 1, 2001
Author(s)
Michael T. Postek, Andras Vladar
Metrology is a principal enabler for the development and manufacture of current and future generations of semiconductor devices. With the potential of 130-nm, and 100-nm, and even smaller linewidths and high-aspect-ratio structures, the scanning electron
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