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John S. Villarrubia, Andras Vladar, J R. Lowney, Michael T. Postek
Optical scatterometry has attracted a great deal of interest for linewidth measurement due to its high repeatability and capability of measuring sidewall shape. We have developed an analogous and complementary technique for the scanning electron microscope
The promise and challenge of nanotechnology is immense. The National Nanotechnology Initiative provides an opportunity to develop a new technological base for U.S. Industry. Nanometrology is the basis of the new measurement methods that must be developed
Michael T. Postek, Andras Vladar, J R. Lowney, William J. Keery
Traditional Monte Carlo modeling of the electron beam specimen interactions in a scanning electron microscope (SEM) produces information about electron beam penetration and output signal generation at either a single beam landing location, or multiple
Michael T. Postek, Andras Vladar, J R. Lowney, William J. Keery
Traditional Monte Carlo modeling of the electron beam-specimen interactions in a scanning electron microscope (SEM) produces information about electron beam penetration and output signal generation at either a single beam-landing location, or multiple
F S. Chien, W F. Hsieh, S Gwo, Andras Vladar, John A. Dagata
Fabrication of silicon nanostructures is a key technique for the development of monolithically integrated optoelectronic circuits. We demonstrate that the process of scanning probe lithography (SPL) and anisotropic TMAH etching is a low-cost and reliable
Crossley E. Jayewardene, William J. Keery, Michael T. Postek, Andras Vladar, Bradley N. Damazo
The National Institute of Standards and Technology (NIST) has provided industry with a scanning electron microscope (SEM) magnification calibration sample Reference Material (RM) 8090. The certified, Standard Reference Material (SRM) version, SRM 2090 is
A series of atomic oscillator strengths measurements was carried out in the last seven years at NIST with a combination of emission spectroscopy and lifetime measurements. Several light elements, specifically C, N, O, F and Ne, and two medium-heavy
Surface roughness affects the function of a wide variety of engineering components, including airport runways, highways, ship hulls and mechanical parts. Perhaps the most demanding applications are in the optics and semiconductor industries. Surface
The ASTM Handbook of Reference Data for Nondestructive Testing (NDT) is a collection of previously available NDT data for use by NDT practitioners. It is intended to be a ready reference guide, and will include chapters on several of the different NDT
The NIST electrostatic force balance compares mechanical probe forces to an SI realization of force derived from measurements of the capacitance gradient and voltage in an electronic null balance. As we approach the nanonewton regime, the finite stiffness
Daniel S. Sawyer, Bruce R. Borchardt, Steven D. Phillips, Charles Fronczek, William T. Estler
We describe a laser tracker calibration system developed for frameless coordinate metrology systems. The system employs a laser rail to provide an 'in situ' calibrated length standard that is used to test a tracker in several different configurations. The
N. Sullivan, M Mastovich, Ronald G. Dixson, P Knutruda, B Bunday, P Febrea, R Brandoma
Resist slimming under electron beam exposure introduces significant measurement uncertainty in the metrology of 193 nm resists. Total uncertainties, which approach 10 nm, can be realized through the combination of across wafer variation of line slimming
Significant differences happened in Rockwell B hardness (HRB) tests using the 1.588 mm diameter ball indenters made by steel and tungsten carbide (WC). In this paper, finite elements analysis (FEA) is used to simulate the HRB indentation process using
Theodore D. Doiron, Eric S. Stanfield, Dennis S. Everett
When a force is exerted on any material, the material deforms. Most of the time the effect is small and is neglected. In the measurement of gauge blocks, where the uncertainty goal is stated in nanometers, the deformation is a very large effect, and can be
In order to meet leading edge and future measurement and calibration needs, NIST has been pursuing the development of atom-based dimensional standards and measurement methods. There are a few new, key concepts underlying this effort, which are intended to
William T. Estler, K L. Edmundson, G Peggs, D H. Parker
Developments in large-scale engineering metrology since the 1978 report of Puttock are reviewed. Advances in optical technology and fast, low-cost computation have led to wide-spread use of laser trackers and digital photogrammetry for general-purpose
We have designed and built a prototype electrostatic force balance for realizing forces in the micronewton range. The active electrodes are concentric cylinders, the outer serving as the reference and the inner suspended and guided by a rectilinear flexure
B Laurenti, Egon Marx, Maria Nadal, M E. McKnight, L Sung
The orientation of platelet-like pigments in coatings is affected by the processing conditions resulting in appearance variations of the final product. A set of aluminum-flake pigmented coatings having different flake orientations was pre-pared using
Egon Marx, I J. Malik, T Bristow, N Poduje, J C. Stover, Y Strausser, M J. Weber
The power spectral density (PSD) formalism is used to characterize a set of surfaces over a wide range of lateral (in-plane, x?y) as well as vertical (out-of-plane, z) dimensions. Twelve 200?mm-diameter Si wafers were prepared; the surface finish ranged
Standard casings and bullets are currently under development to support the National Integrated Ballistics information Network (NIBIN). The master casings are obtained from the ATF''s National Laboratory Center at Rockville, MD, by a standardized shooting
Electromagnetic scattering of an incident plane monochromatic wave by dielectric or finitely conducting infinite cylinders of arbitrary cross section can be reduced to the solution of scalar Helmholtz equations in two dimensions for the components of the
F S. Chien, W F. Hsieh, S Gwo, Andras Vladar, John A. Dagata
Fabrication of silicon nanostructures is a key technique for the development of monolithically integrated optoelectronic circuits. We demonstrate that the process of scanning probe lithography (SPL) and anisotropic TMAH etching is a low-cost and reliable