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Electronics

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Displaying 276 - 300 of 690

Electro-optic sampling for traceable high-speed electrical measurements

May 23, 2010
Author(s)
Paul D. Hale, Dylan F. Williams
We will describe how the complex frequency response of a high-speed photodiode is calibrated by use of electro-optic sampling. Our uncertainty analysis includes a unique covariance-matrix based method that allows us to transform uncertainties between the

Multiwalled carbon nanotubes coated with silicon carbonitride (SiCN)

April 1, 2010
Author(s)
Katie Hurst, Christopher L. Cromer, Elisabeth Mansfield, Roop Mahajan, John H. Lehman, Gurpreet Singh
We describe the development of two next-generation optical coatings; amorphous polymer-derived silicon carbonitride (SiCN) particles and a composite consisting of SiCN surrounding a multiwalled carbon nanotube (MWCNT) core. Laser-induced damage testing of

Towards Standardized Waveguide Sizes and Interfaces for Submillimeter Wavelengths

March 22, 2010
Author(s)
Ronald A. Ginley, Dylan Williams, N M. Ridler, J L. Hesler, Anthony R. Kerr, R D. Pollard
This paper describes an activity that has begun recently to develop an international standard for rectangular metallic waveguides and their interfaces for frequencies of 110 GHz and above. The IEEE's Microwave Theory and Techniques Society (MTT-S) is

Interoperability Test of IEEE 1451.5 Standard-Based Wireless Sensors

March 13, 2010
Author(s)
Kang B. Lee, Yuyin Song
The Institute of Electrical and Electronics Engineers (IEEE) 1451 standard provides plug-and-play capability of smart transducers (sensors and actuators). Plug-and-play is an important aspect of interoperability, which is the ability of two or more systems

How Accurate is a Radio Controlled Clock?

March 1, 2010
Author(s)
Michael A. Lombardi
This paper discusses the factors that determine the accuracy of radio controlled clocks. The topics covered including the accuracy of the time signal station, path delay, synchronization errors, and the time error that accumulates between synchronizations.

Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires

January 25, 2010
Author(s)
Rebekah L. Graham, Glenn Alers, Thomas Mountsier, N. Shamma, S. Dhuey, R. H. Cabrini, Roy H. Geiss, David T. Read, S. Peddeti
The electron scattering mechanisms in sub-50nm copper lines were investigated to understand the extendibility of copper interconnects when the line width or thickness is less than the mean free path. Electron-beam lithography and a dual hardmask approach

Molecular transistors scrutinized

December 23, 2009
Author(s)
James G. Kushmerick
Transistors have been made from single molecules, where the flow of electrons is controlled by modulating the energy of the molecular orbitals. Insight from such systems could aid the development of future electronic devices.

Nanoelectronic Fabrication with Flip Chip Lamination

December 15, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.

Chemical Science and Technology Laboratory (CSTL) 2009 Annual Report

November 17, 2009
Author(s)
Willie E. May, Richard R. Cavanagh, Dianne L. Poster, Michael D. Amos
CSTL is entrusted with building, sustaining, and maximizing the chemical measurement system that is criticial to chemical technological innovation, economic competitiveness and new job growth for the benefit of the Nation.

Fabrication with Flip-Chip Lamination

November 15, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, Nanotechnology colloquium, Wake Forest University, 11-09.

Fabrication with Flip-Chip Lamination

October 15, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, MRSEC surface physics colloquium, University of Maryland, College Park, 10-09.

Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films

October 13, 2009
Author(s)
Ryan P. Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss, David T. Read, Reinhold Dauskardt
Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu purity

High-Voltage Capacitance Measurement System for SiC Power MOSFETs

September 24, 2009
Author(s)
Parrish Ralston, Tam H. Duong, Nanying Yang, David W. Berning, Colleen E. Hood, Allen R. Hefner Jr., Kathleen Meehan
Adequate modeling of a power MOSFET is dependent on accurate characterization of the inter-electrode capacitances. With the advent of high voltage silicon carbide (SiC) power MOSFETs, it has become important to develop a measurement system that can perform

Outdoor-to-Indoor Channel Measurements and Models

September 1, 2009
Author(s)
Catherine A. Remley, Christopher L. Holloway, David W. Matolak
This document reports on wireless channel measurements and models for outdoor to indoor propagation environments. Although there have been a number of publications that have recently appeared on this topic, e.g., [1], [2], and references therein, the
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