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Pedro I. Espina, Stephen D. Ridder, U Piomelli, Frank S. Biancaniello
The gas-only flow in a close-coupled, gas-metal atomizer is Studied to determine the influence of operational parameters on The structure of the flow field. A
Multimedia desktop conferencing systems that include audio, video and application sharing are gaining momentum and increasingly becoming a reality. This paper
M L. Hsieh, E G. Paek, Charles L. Wilson, K Y. Hsu
Conventional electrically addressable spatial light modulators turned out to have different transfer function along the fast (horizontal) and the slow (vertical
This introductory chapter is intended to acquaint the reader with the unusual properties of supercritical fluids, and with the ways these properties are
A variety of different kinds of photomask critical dimensions (CD) metrology tools are available today to help meet current and future metrology challenges
2-aminopurine (2AP) is a highly fluorescent isomer of adenine that can be incorporated into DNA as a probe of structure, dynamics, and protein-DNA interactions
The progress and challenges in thermal lattice Boltzmann modeling are discussed. In particular, momentum and energy closures schemes are contrasted. Higher
Loucas G. Christophorou, James K. Olthoff, David S. Green
In an effort to respond to the recent concerns over the possible impact of SF 6 on global warming, we have searched for an SF 6 substitute gas that could be
X. Han, Yicheng Wang, Loucas G. Christophorou, Richard J. Van Brunt
An important tool for improving the reliability of HV-insulation systems relies on partial discharge (PD) measurements. The assessment of the insulation failure
Discharge currents and degradation of polyethylene from high dc electric field stress in air were investigated. A positive point-to-plane configuration was used
Yicheng Wang, Loucas G. Christophorou, James K. Olthoff, J. K. Verbrugge
Measurements are reported of (i) the electron drift velocity in pure trifluoromethane (CHF 3) gas and in its mixtures with argon, and (ii) electron attachment
In integrated circuit manufacturing, the gaps between metal lines are a critical parameter, and polymer films are being evaluated as materials to fill these