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Convective Accelerometer and Tilt Sensor in CMOS Technology



V. Milanovic, E. D. Bowen, N. H. Tea, Michael Gaitan, Mona E. Zaghloul


This paper describes a CMOS implementation of novel ID and 2D accelerometers that operate based on heat convection, requiring no solid proof mass. The devices consist of micromachined microheaters and thermocouple sensors separated by a gap and placed in differential configurations. Thermocouple sensors measure the temperature difference between two sides of the microheater caused by the effect of acceleration on free convection in the surrounding gas. The devices show small linearity error of < 0.5% under tilt conditions from -90 degrees C to 90 degrees C, and < 1.6% under acceleration from 0 g to 8 g. Sensitivity of the devices is a nearly linear function of heater power (temperature). For operating power between 35 mW and 45 mW, sensitivity of 20 υV/g to 30 υV/g was measured.
Proceedings Title
Proc., American Society of Engineers Conference
Conference Dates
November 12-15, 1998
Conference Location
Anaheim, CA, USA
Conference Title
American Society of Engineers Conference


accelerometer, CMOS, convection, micromachining, sensors, thermopile, tilt sensor


Milanovic, V. , Bowen, E. , Tea, N. , Gaitan, M. and Zaghloul, M. (1998), Convective Accelerometer and Tilt Sensor in CMOS Technology, Proc., American Society of Engineers Conference, Anaheim, CA, USA (Accessed May 24, 2024)


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Created November 11, 1998, Updated October 12, 2021