Projects/Programs

Displaying 1 - 25 of 129

Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage

Ongoing

Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects

Accurate Mapping of Thermal Properties at the Nanoscale

Ongoing

Continuous advances in the performance and functionality of semiconductor devices have been driven by scale reduction, incorporation of new and nanomaterials, and by heterogeneous integration (HI). However, such scaling and integrated architecture has rendered existing thermal metrology inadequate

Additive Manufacturing of Ceramics

Ongoing

Additive manufacturing (AM) is a rapidly growing suite of technologies that has been a national priority since 2012. Compared to metals and polymers AM, the commercial adaptation of ceramics AM is still in its infancy. Nevertheless, ceramics AM is actively explored for applications in aerospace

EBSD grain orientation map for additively manufactured Ti-6Al-4V showing elongated prior-Beta grain morphology in the build direction (vertical in this image)"

Additive Manufacturing Fatigue and Fracture

Ongoing

Metal additive manufacturing (AM) is not used in fatigue and fracture critical applications despite industrial need. The goal of this project is to enable confident use of metal AM in critical applications through: Advancing metrological practice for AM-specific performance metrics encompassing the

Build plate of additively manufactured (AM) metal parts with microstructure comparison between wrought and AM material

Additive Manufacturing of Metals

Ongoing

The Additive Manufacturing of Metals Project, which has participants from multiple groups and divisions, and has three primary objectives: Develop and utilize novel local and in situ measurement capabilities for establishing AM mechanisms responsible for processing and post-processing pathways in AM

Advanced Data Exchange Standards for the Biomanufacturing Supply Chain

Ongoing

Objective The objective of this project is to develop measurement science that includes methods, workflow models, information meta-models, interoperability metrics, and prototype tools to help U.S. manufacturers reduce the time and cost associated with making supply chain data accessible for better

Advanced Informatics and Artificial Intelligence for Additive Manufacturing

Ongoing

Objective To develop and deploy the metrics, models, and best practices for implementing and adopting advanced informatics (including product definition, digital twins, machine learning and advanced analytics) and artificial intelligence to enhance additive manufacturing design, process planning

Advanced Machines, Monitoring, and Control for AM

Ongoing

Objective To develop, integrate, and implement real-time feedback and other cutting-edge process control techniques using advanced monitoring tools such as high-speed imaging and diffraction for single and multi-laser AM systems. Technical Idea The current methods for AM control predominantly rely

Advanced Manufacturing Data Infrastructure and Analytics Program

Ongoing

Objective The Advanced Manufacturing Data Infrastructure and Analytics (AMDIA) Program will develop and deploy measurement science to advance a data infrastructure that will improve the productivity, resiliency, and sustainability of manufacturing operations and supply chains to enhance U.S

Cross section of a SAC solder joint in a BGA, with sketches of potential micro specimens

Advanced Mechanical Characterization of Mesoscale Materials

Ongoing

Knowledge of a material’s mechanical properties is key to designing safe and reliable structural components for applications ranging in size from medical implants to large civil engineering structures. Traditionally, a material’s mechanical properties are measured by performing mechanical tests on

Advanced Metrology to Enable Next Generation EUV Photoresists

Ongoing

EUV (extreme ultraviolet) lithography, the technology that “saved Moore’s Law,” is widely regarded as the future of cutting-edge nanofabrication. It was developed in the United States and U.S. companies in many parts of the EUV ecosystem have established dominance in the field that must be defended

Advancing Power Electronics with Defect Metrology

Ongoing

Power electronics play a central role in all aspects of electrical energy storage, distribution, conversion, and consumption. Currently, power electronics heavily rely on Si-based insulated-gate bipolar transistors (IGBT), which have large footprints, are inefficient, and require extensive cooling

Agility Performance of Robotic Systems

Ongoing

Objective Deliver robot agility performance metrics, test methods, information models, datasets, combined virtual/real testbeds, and planning approaches that will enable manufacturers to more easily and rapidly reconfigure, retask, and redeploy robotic systems. Technical Idea The project is

Agri-Food Manufacturing System and Supply Chain Integration

Ongoing

Objective: Deploy new standards and reference data supporting agri-food manufacturing systems to enable industry to more efficiently and cost effectively produce food-based products of higher quality and with improved food safety. Technical Idea: Today, food producers face many challenges include

ASTM Committee F45 on Driverless Automatic Guided Industrial Vehicles

Ongoing

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Augmented Intelligence for Manufacturing Systems (AIMS)

Ongoing

Objective To overcome existing measurement challenges via augmented intelligence, the fusion of integrated metrology, physics-based models, and artificial intelligence, to enable monitoring, diagnostics, and prognostics of manufacturing systems and their processes. Technical Idea One research

Automotive Lightweighting

Ongoing

The US auto industry spends $600M per year fixing and tweaking forming dies that do not make correct parts. The primary reason that the dies are inaccurate is that the computer models of the dies utilize materials models that are inaccurate. Upon surveying our industrial partners, we determined that

EV Battery Passport

Completed

End-of-life issues associated with EV batteries (EVBs) are estimated to have a steep rise in the coming decades. Given the finite nature of material resources worldwide, developing a circular EV batteries (EVB) infrastructure is needed to keep high value battery materials in the economy, therefore

Biofabrication of Tissue Engineered Constructs

Ongoing

OCT imaging was assessed using a model scaffold-cell system consisting of a polysaccharide-based hydrogel seeded with human Jurkat cells. Four test systems were used: hydrogel seeded with live cells, hydrogel seeded with heat-shocked or fixed dead cells and hydrogel without any cells. Time series

Characterization of Additive Manufacturing Materials

Completed

Objective: Deliver new standardized feedstock and AM-built material characterization methods, exemplar data, and databases to accelerate the design and use of additive manufacturing parts in high-performance applications (e.g., critical parts in high-stress applications such as turbine blades or

Characterization of 3D Photovoltaics

Completed

First Generation (thick layers of crystalline silicon) and Second Generation (thin films of CdTe, CIGS, and related materials) PV devices are both well established in the marketplace, with well defined techniques for fabrication and characterization. Third Generation PV encompasses a wide diversity

Chemical Functionalization and Manipulation of Nano Materials

Completed

This project focuses on manipulating nanomaterials, including weakly bonded van der Waals systems, and probing emergent phenomena in these nanoengineered systems to impact technologies such as nanoelectronics, optoelectronics, quantum sensing, and quantum computing. Developing processes to

Commissioning Building Systems for Improved Performance and Cybersecurity

Ongoing

Objective To improve the performance of building systems by providing the measurement science needed to develop improved building commissioning techniques that utilize embedded capabilities of building control systems, accelerate the adoption of cost-effective commissioning as standard practice and

Diagram of the CDSAXS method, shows an x-ray beam going through a sample and onto an e-ray detector.

Critical Dimension Small Angle X-Ray Scattering (CDSAXS) for Next Generation in-line Metrology

Ongoing

The semiconductor industry is in need of new in-line dimensional metrology methods to measure the size and shape of nanoscale structures such as gate-all-around transistors, 3D-NAND, and 3D-DRAM for process control. The NIST-developed CDSAXS method has recently been commercialized for

Cruciform Multiaxial Mechanical Testing

Ongoing

A new ARRA funded cruciform test machine is being installed in the NIST Center for Automotive Lightweighting. Its capabilities include 500kN load per axis, two DIC strain mapping systems (one for large field mapping and one for zooming in to study localizations or features), a high resolution, high

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
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--Communications Technology Laboratory
---RF Technology Division
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---Applied Cybersecurity Division
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----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
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---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
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----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
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----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
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----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
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--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
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----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
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----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
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----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
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----Applied Physics - HQ
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----Quantitative Nanostructure Characterization Group
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----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
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----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
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----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
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-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
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---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
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---Program Operations Division
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---Strategy and Planning Division
----Analysis and Benchmarking Group
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----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
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----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
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--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
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---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ