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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
The NIST program seeks to facilitate the commercialization of the ceramics additive manufacturing via the concurrent development of: New measurement approaches
This project aims to enable use of metal additive manufacturing (AM) in fatigue and fracture critical applications via two main thrusts: Develop appropriate
The Advanced Manufacturing Data Infrastructure and Analytics (AMDIA) program will lay the groundwork for advanced data infrastructure and corresponding
We develop methods to evaluate the mechanical behavior of micro- and mesoscale metal alloys to fracture, and Micro Electro Mechanical Systems (MEMS) materials
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is
The application of robotics in manufacturing is hindered by their lack of agility, including their large changeover times for new tasks/products and their
The U.S. agriculture sector extends beyond the farm business to include a range of farm-related industries. The largest of these are food service and food
Our objective is to support the efforts of the US automotive industry and its suppliers to incorporate advanced lightweight materials for improving fuel economy
Digital battery passports (DBPs), if implemented on a large scale, can provide the electric vehicle battery community with valuable data to support sustainable
Currently there is a significant interest in using additively manufactured parts in high-performance applications. However, due to a lack of publicly available
Our goal is to provide industry with test structures and models of next-generation photovoltaics, with an initial focus on cadmium telluride (CdTe) and CuIn x
This project focuses on understanding the potential for nanoscale engineered materials to advance state-of-the-art spectroscopic techniques and foster the
Building systems commissioning processes applied at the design phase and throughout the building life cycle have been shown to effectively improve performance
The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The
Crystal Plasticity Modeling calculates multiaxial mechanical constitutive behavior by treating the sample as an interacting aggregate of single crystals that
The definitions of cyber-physical systems (CPS) and the Internet of Things (IoT) are converging over time to include a common emphasis on hybrid systems of
The definitions of cyber-physical systems (CPS) and the Internet of Things (IoT) are converging over time to include a common emphasis on hybrid systems of
A key challenge to progress in cyber-physical systems (CPS) and the Internet of Things (IoT) is the lack of robust platforms for experiment and testing, which
Develop and deploy advances in measurement science that enable key dimensions of cybersecurity for smart manufacturing systems, services, and components.
In simple terms, smart manufacturing systems have the ability to transform data gathered from a variety of manufacturing processes into actionable knowledge for
“Digital disruption is a change in industry triggered by advances in information and communications technology. During the next few years, the technologies