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Our objective is to develop metrology techniques for characterizing mechanical strain in semiconductor devices as well as reference materials for assessing the
Mechanical strain impacts the performance of semiconductor devices. Manufacturing processes must be carefully controlled for strain to achieve high-yield and
The aim of this project is to develop robust, quantitative measurement methods utilizing transmission electron microscopy methods for complex, nanostructured
The human brain does some types of information processing, like speech recognition, image recognition, or video processing, much more efficiently than can be
Renewable energy sources such as solar energy are attractive alternatives to fossil fuels because of their abundant supply and pollution-free power generation
The overarching objective of this project is reliably calculating the bulk optical properties of materials, such as complex index of refraction, absorption, and
The thermal properties of materials and interfaces that govern the performance, reliability, and thermal management in microelectronics packages and wide
The Thin Film Electronics Project develops rigorous measurements and methodology needed for continued U.S. leadership in manufacturing and innovation of
Time-resolved-emission microscopy (TREM) is a workhorse of semiconductor circuit evaluation. However, as transistor dimensions and power-supply voltages have
Machine learning and artificial intelligence (AI) have advanced so rapidly that they can now outperform humans at many (or even most) tasks. However, the large
Develop critical thermal and electrical transport measurement methods, instrumentation, and reference materials needed to support the development, performance