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Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
The development of new materials for diverse applications relating to the development of new energy sources, more efficient homes, autos, and aircraft, and the
Using methods such as electronic structure (such as density functional theory, tight-binding, quantum Monte Carlo), force-field, machine-learning and quantum
An integrated computational materials engineering (ICME) approach is employed to link experimental and computational models across a variety of time and length
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is
As part of NIST's response to the Materials Genome Initiative (MGI), this project provides resources to address some of the challenges to the wider use of
This project provides and develops novel computational infrastructure (i.e. data archives, open-source codes, APIs) that support the design, execution, and
Our objective is to support the efforts of the US automotive industry and its suppliers to incorporate advanced lightweight materials for improving fuel economy
Single-wall carbon nanotubes are an important class of carbon nanomaterials with significant potential for commercial applications. The National Institute of
Our goal is to provide industry with test structures and models of next-generation photovoltaics, with an initial focus on cadmium telluride (CdTe) and CuIn xGa
Our goal is to develop combinatorial library approaches for measuring and optimizing the effect of substrate chemical functionalization on the structure and
As part of NIST's response to the Materials Genome Initiative (MGI), this project addresses the need for automation for the assembly and distribution of
The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The
Crystal Plasticity Modeling calculates multiaxial mechanical constitutive behavior by treating the sample as an interacting aggregate of single crystals that
The development of a materials innovation infrastructure (MII) that will enable rapid and significant reductions in the development time for new materials with
Develop a materials innovation infrastructure for the design and discovery of inorganic materials to reduce the time and cost for deploying new materials into
Reproducibility and reuse play fundamental roles in the development of science. With the growth of computational power and tools, simulated experiments have
Our goal is to develop and demonstrate precise measurement methods that quantify the physical shape, critical dimensions (CD) and the structure of nanoscale
This project provides property data, new metrology and contributes to standard test method development for materials systems subject to extreme mechanical and
In this project we develop and apply electrochemical and surface science principles to the study of advanced wet chemical deposition processes and emerging
The goal of the project is to develop measurement methods to characterize the nanoscale structure and dynamics of polymer electrolyte membranes (PEMs) to enable