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Notice of Funding Opportunity: Commercial Fabrication Facilities

Photo illustration of a circuit board
Credit: Adobe Stock

CHIPS for America is pleased to announce the first funding opportunity for its incentives program, which aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security.

This funding opportunity seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. Two additional funding opportunities—for materials and manufacturing equipment facilities, and for research and development facilities—will be announced later this year.

Statements of interest from all potential applicants will be accepted on a rolling basis beginning February 28, 2023. For potential applications for leading-edge facilities, pre-applications (optional) and full applications will be accepted on a rolling basis beginning March 31, 2023. For potential applications for current-generation, mature-node, and back-end production facilities, pre-applications (recommended) will be accepted on a rolling basis beginning May 1, 2023, and full applications will be accepted on a rolling basis beginning June 26, 2023.

Please find the application portal here. Below you will also find links to helpful resources, including key dates, fact sheets, and frequently asked questions. For more application-related questions, please email apply [at] For general inquiries, email askchips [at]

Created February 13, 2023, Updated March 27, 2023