Intel Corporation (Oregon)

Project Summary

The U.S. Department of Commerce awarded Intel up to $7.865 billion in direct funding under the CHIPS and Science Act. This funding will support Intel’s expected U.S. investment of nearly $90 billion by the end of the decade, part of the company’s overall $100+ billion expansion plan, to expand capacity and capabilities at its sites in Arizona, New Mexico, Ohio, and Oregon. With this funding, Intel plans to develop a robust domestic semiconductor ecosystem, advancing U.S.-based leading-edge production. As previously announced and with the Department's support, Intel's overall expansion plan is estimated to support approximately 10,000 manufacturing jobs and 20,000 construction jobs across all four states. 

Economic and National Security Impact

Intel is taking a significant step to strengthen the U.S. supply chain and re-establish American leadership in semiconductor manufacturing. Because of this investment, Intel plans to mass fabricate their most advanced leading-edge logic nodes in Arizona and Ohio, conduct advanced packaging at scale in New Mexico, and fortify a critical domestic R&D and technology development capability in Oregon to unlock the next generation of semiconductor technology.

This funding will spur investment in leading-edge logic chip manufacturing, packaging, and R&D facilities to expand in the United States by investing in Intel’s projects:

• Chandler, Arizona: Construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic manufacturing capacity, including high volume domestic production of Intel 18A – which features RibbonFET gate all-around (GAA) transistor technology and PowerVia backside power delivery.
• Rio Rancho, New Mexico: Modernization of two existing fabs into an advanced packaging facility to close an important gap in the domestic semiconductor supply chain. When in full production, this facility will be the largest advanced packaging facility in the United States.
• New Albany, Ohio: Creation of a new regional chipmaking ecosystem, anchored by a new leading-edge logic fab, which is part of Intel’s broader commitment to build two leading-edge fabs, that will produce the Intel 14A node and other future Intel nodes and expand leading-edge foundry capacity.
• Hillsboro, Oregon: Investment in the premier hub of leading-edge research and development in the United States through the modernization of technology development facilities that will utilize the world’s first commercial High-NA EUV lithography equipment. The Oregon site is being used to develop and produce Intel’s 18A and future nodes and is one of only three locations in the world where leading-edge process technology is developed.

Financial and Commercial Terms

As stated in the CHIPS Notice of Funding Opportunity (NOFO) for Commercial Fabrication Facilities, CHIPS for America will disburse direct funding to Intel for capital expenditures spent on the projects based on the completion of construction, technology, production, and commercial milestones. The CHIPS Program Office will track the performance of each CHIPS Incentives Award via financial and programmatic reports, in accordance with the award terms and conditions. All CHIPS funding recipients are required to adhere to restrictions pursuant to the CHIPS Act and NOFO regarding stock buybacks and national security guardrails, which limit the sharing of intellectual property. The Department and Intel have agreed that the company will not engage in stock buybacks for a period of five years, with specific exceptions.

Workforce, Community, and Environmental Commitments

As part of our commitment to transparency, for information on the local and community impact of this project, please download our Community Impact Report.