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Search Publications by: Yaw S. Obeng (Fed)

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Displaying 1 - 25 of 86

INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMSTM 2023 EDITION METROLOGY

December 8, 2023
Author(s)
Elisabeth Mansfield, Bryan Barnes, R Joseph Kline, Andras E. Vladar, Yaw S. Obeng, Albert Davydov
The Metrology Chapter identifies emerging measurement challenges from devices, systems, and integration of new materials in the semiconductor industry and describes research and development pathways for meeting them. This includes but not limited to

Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated Systems

September 30, 2022
Author(s)
Papa Amoah, Joseph J. Kopanski, Yaw S. Obeng, Christopher Sunday, Chukwudi Okoro, Lin You, Dmirty Veksler
In this paper, we present an overview of our current research focus in developing non-destructive metrology for monitoring reliability issues in 3D-integrated electronic systems. We introduce a suite of non-destructive metrologies that can serve as early

Broadband Dielectric Spectroscopic Detection of Ethanol: A Side-by-Side Comparison of ZnO and HKUST-1 MOFs as Sensing Media

June 25, 2022
Author(s)
Papa Amoah, Pentao Lin, Zeinab Mohammed Hassan, Rhonda Franklin, Engelbert Redel, Helmut Baumgart, Yaw S. Obeng
Changes in the chemo-electrical intrinsic properties of metal-oxide materials (MO) are commonly used as the basis of gas sensors. The most common gas sensors are based on chemically induced changes in electrical resistivity which necessarily involve making

Models for an Ultraviolet-C Research and Development Consortium

March 25, 2022
Author(s)
Dianne L. Poster, C Cameron Miller, Yaw S. Obeng, John J. Kasianowicz, Michael T. Postek, Norman Horn, Troy Cowan, Richard Martinello
The development of an international, precompetitive, collaborative, ultraviolet (UV) research consortium is discussed as an opportunity to lay the groundwork for a new UV commercial industry and the supply chain to support this industry. History has

Deterministic Tagging Technology for Device Authentication

September 16, 2021
Author(s)
Jungjoon Ahn, Joseph J. Kopanski, Yaw S. Obeng, Jihong Kim
This paper discusses the development of a rapid, large-scale integration of deterministic dopant placement technique for encoding information in physical structures at the nanoscale. The doped structures inherit identical and customizable radiofrequency

Ultraviolet Radiation Technologies and Healthcare Associated Infections: Standards and Metrology Needs

August 20, 2021
Author(s)
Dianne L. Poster, C Cameron Miller, Richard Martinello, Norman Horn, Michael T. Postek, Troy Cowan, Yaw S. Obeng, John J. Kasianowicz
The National Institute of Standards and Technology (NIST) hosted an international workshop on ultraviolet-C (UV-C) disinfection technologies on January 14 – 15, 2020 in Gaithersburg, Maryland in collaboration with the International Ultraviolet Association

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air/Film Interface

September 17, 2020
Author(s)
Yaw S. Obeng, Papa K. Amoah, Christopher E. Sunday, Jesus Perez, Uros Cvelbar, Martin Kosicek
Contactless broadband microwave spectroscopic technique (a.k.a., broadband dielectric spectroscopy (BDS)) enables the accurate operando analysis of the electrical and magnetic properties applying without compromising the kinetic conditions of the

Contactless Resonant Cavity Dielectric Spectroscopic Studies of Recycled Office Papers

November 5, 2019
Author(s)
Mary Kombolias, Jan Obrzut, Michael T. Postek, Dianne L. Poster, Yaw S. Obeng
Current product composition and quality test methods for the paper and pulp industry are rooted in wet-bench chemistry techniques which are highly subjective. These techniques have rather limited utility and cannot be used to distinguish between virgin and

Contactless Resonant Cavity Dielectric Spectroscopic Studies of Cellulosic Paper Aging

August 28, 2019
Author(s)
Mary Kombolias, Jan Obrzut, Michael T. Postek, Dianne L. Poster, Yaw S. Obeng
The current analytical techniques for characterizing printing and graphic arts substrates, particularly those used to date and to authenticate provenance, are largely ex situ and destructive. This limits the amount of data that can be captured from an

INNOVATIVE APPROACH TO COMBAT HEALTHCARE-ASSOCIATED INFECTIONS USING STANDARDS DEVELOPED THROUGH INDUSTRY AND U.S. FEDERAL COLLABORATION

June 14, 2019
Author(s)
Carl C. Miller, Thomas C. Larason, Dianne L. Poster, Yaw S. Obeng, Mike Postek, Richard Martinello
Nationwide, healthcare-associated infections (HAIs) infect one in every 25 hospital patients, account for more than 99,000 deaths and increase medical costs by more than $35 billion, each year. Ultraviolet-C (UV-C) antimicrobial devices are shown to reduce

Probe assisted localized doping of aluminum into silicon substrates

February 20, 2019
Author(s)
Jungjoon Ahn, Santiago D. Solares, Lin You, Hanaul Noh, Joseph Kopanski, Yaw S. Obeng
In this paper, we demonstrate AFM probe assisted deterministic doping (PADD) of Al into an n- type Si (100) wafer, to generate nanoscale counter-doped junctions with a few nanometers depth from Si surface. The local electrical potential changes resulting