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Publications

Search Publications by Yaw S. Obeng

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Displaying 1 - 25 of 76

Deterministic Tagging Technology for Device Authentication

September 16, 2021
Author(s)
Jungjoon Ahn, Joseph Kopanski, Yaw S. Obeng, Jihong Kim
This paper discusses the development of a rapid, large-scale integration of deterministic dopant placement technique for encoding information in physical structures at the nanoscale. The doped structures inherit identical and customizable radiofrequency

Ultraviolet Radiation Technologies and Healthcare Associated Infections: Standards and Metrology Needs

August 20, 2021
Author(s)
Dianne L. Poster, C Cameron Miller, Richard Martinello, Norman Horn, Michael T. Postek, Troy Cowan, Yaw S. Obeng, John J. Kasianowicz
The National Institute of Standards and Technology (NIST) hosted an international workshop on ultraviolet-C (UV-C) disinfection technologies on January 14 – 15, 2020 in Gaithersburg, Maryland in collaboration with the International Ultraviolet Association

Broadband Microwave Signal Dissipation in Nanostructured Copper Oxide at Air/Film Interface

September 17, 2020
Author(s)
Yaw S. Obeng, Papa K. Amoah, Christopher E. Sunday, Jesus Perez, Uros Cvelbar, Martin Kosicek
Contactless broadband microwave spectroscopic technique (a.k.a., broadband dielectric spectroscopy (BDS)) enables the accurate operando analysis of the electrical and magnetic properties applying without compromising the kinetic conditions of the

Contactless Resonant Cavity Dielectric Spectroscopic Studies of Recycled Office Papers

November 5, 2019
Author(s)
Mary Kombolias, Jan Obrzut, Michael T. Postek, Dianne L. Poster, Yaw S. Obeng
Current product composition and quality test methods for the paper and pulp industry are rooted in wet-bench chemistry techniques which are highly subjective. These techniques have rather limited utility and cannot be used to distinguish between virgin and

Contactless Resonant Cavity Dielectric Spectroscopic Studies of Cellulosic Paper Aging

August 28, 2019
Author(s)
Mary Kombolias, Jan Obrzut, Michael T. Postek, Dianne L. Poster, Yaw S. Obeng
The current analytical techniques for characterizing printing and graphic arts substrates, particularly those used to date and to authenticate provenance, are largely ex situ and destructive. This limits the amount of data that can be captured from an

INNOVATIVE APPROACH TO COMBAT HEALTHCARE-ASSOCIATED INFECTIONS USING STANDARDS DEVELOPED THROUGH INDUSTRY AND U.S. FEDERAL COLLABORATION

June 14, 2019
Author(s)
Carl C. Miller, Thomas C. Larason, Dianne L. Poster, Yaw S. Obeng, Mike Postek, Richard Martinello
Nationwide, healthcare-associated infections (HAIs) infect one in every 25 hospital patients, account for more than 99,000 deaths and increase medical costs by more than $35 billion, each year. Ultraviolet-C (UV-C) antimicrobial devices are shown to reduce

Probe assisted localized doping of aluminum into silicon substrates

February 20, 2019
Author(s)
Jungjoon Ahn, Santiago D. Solares, Lin You, Hanaul Noh, Joseph J. Kopanski, Yaw S. Obeng
In this paper, we demonstrate AFM probe assisted deterministic doping (PADD) of Al into an n- type Si (100) wafer, to generate nanoscale counter-doped junctions with a few nanometers depth from Si surface. The local electrical potential changes resulting

Microwave Monitoring of Atmospheric Corrosion of Interconnects

December 28, 2018
Author(s)
Papa Amoah, Dmitry Veksler, Christopher E. Sunday, Stephane Moreau, David Bouchu, Yaw S. Obeng
Traditional metrology has been unable to adequately address the reliability needs of emerging integrated circuits at the nano scale; thus, new metrology and techniques are needed. In this paper, we use microwave propagation characteristics (insertion

Metrology for the next generation of semiconductor devices

October 12, 2018
Author(s)
Ndubuisi G. Orji, Mustafa Badaroglu, Bryan M. Barnes, Carlos Beitia, Benjamin D. Bunday, Umberto Celano, Regis J. Kline, Mark Neisser, Yaw S. Obeng, Andras Vladar
The semiconductor industry continues to produce ever smaller devices that are ever more complex in shape and contain ever more types of materials. The ultimate sizes and functionality of these new devices will be affected by fundamental and engineering

Innovative Approaches to Combat Healthcare-Associated Infections Using Efficacy Standards Developed Through Industry and Federal Collaboration

October 5, 2018
Author(s)
Dianne L. Poster, Carl C. Miller, Yaw S. Obeng, Michael T. Postek, Troy E. Cowan, Richard A. Martinello
Nation-wide, healthcare-associated infections (HAIs) infect one in every 25 hospital patients, account for more than 100,000 deaths and increase medical costs by around $96-147B, each year. Ultraviolet-C (UV-C) antimicrobial devices are shown to reduce the

Virtual Metrology White Paper - INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS(IRDS)

April 9, 2018
Author(s)
Ndubuisi G. Orji, Yaw S. Obeng, Carlos Beitia, Supika Mashiro, James Moyne
This white paper provides an overview of virtual metrology (VM) and the benefits it can provide, with cost reduction (both capital expenditure and cycle time) being the primary benefit. The white paper also examines some of the issues preventing wider

Remote Bias Induced Electrostatic Force Microscopy for Subsurface Imaging

March 5, 2018
Author(s)
Joseph J. Kopanski, Lin You, Yaw S. Obeng
Contrast in electrostatic force microscopy (EFM) depends on the electrostatic force between the tip and sample. In the related technique, scanning Kelvin force microscopy (SKFM), contrast arises from the force due to the capacitance gradient with tip-to

Microwave Evaluation of Electromigration Susceptibility in Advanced Interconnects

November 1, 2017
Author(s)
Yaw S. Obeng, Kin P. Cheung, Dmitry Veksler, Christopher E. Sunday
Traditional metrology has been unable to adequately address the needs of emerging integrated circuits (ICs) at the nano scale; thus, new metrology and techniques are needed. For example, the reliability challenges in fabrication need to be well understood

The Impact of Organic Additives On Copper Trench Microstructure

June 28, 2017
Author(s)
James B. Marro, Chukwudi A. Okoro, Yaw S. Obeng, Kathleen C. Richardson
Organic additives are typically used in the pulse electrodeposition of copper (Cu) to prevent void formation during the filling of high aspect ratio features. In this work, the role of bath chemistry as modified by organic additives was investigated for