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Search Publications by: Curt A. Richter (Fed)

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Displaying 101 - 125 of 243

Metal-Molecule-Silicon Junctions Produced by Flip Chip Lamination of Dithiols

February 1, 2011
Author(s)
Michael A. Walsh, Curt A. Richter, Christina A. Hacker
The integration of organic molecules with silicon is increasingly being studied for potential uses in hybrid electronic devices. Creating dense and highly ordered organic monolayers on silicon with reliable metal contacts still remains a challenge. A novel

Switching in Flexible Titanium Oxide Memristors

June 25, 2010
Author(s)
Joseph L. Tedesco, Nadine E. Gergel-Hackett, Laurie A. Stephey, Christina A. Hacker, Curt A. Richter
In this study, memristors were fabricated on flexible polyethylene terephthalate (PET) substrates with aluminum contacts and a titanium dioxide film formed with a sol-gel of titanium isopropoxide and ethanol. To study the electric field dependence of

Probing Stress Effects in Single Crystal Organic Transistors by Scanning Kelvin Probe Microscopy

May 1, 2010
Author(s)
L C. Teague, Oana Jurchescu, Curt A. Richter, Sanker Subramanian, John E. Anthony, Thomas Jackson, David J. Gundlach, James Kushmerick
We report scanning Kelvin probe microscopy SKPM of single crystal difluoro bistriethylsilylethynyl anthradithiophene diF-TESADT organic transistors. SKPM provides a direct measurement of the intrinsic charge transport in the crystals independent of contact

Metrology of Molecular Devices made by Flip Chip Lamination

April 30, 2010
Author(s)
Christina A. Hacker, Mariona Coll Bau, Curt A. Richter
Scaling of conventional electronics has continued unabated to dimensions approaching fundamental physical limits. As technology continues to evolve there are increasing demands to identify alternate routes of performing electrical functions. One potential

Flexible Memristors

April 28, 2010
Author(s)
Nadine E. Gergel-Hackett, Laurie A. Stephey, Barbara Dunlap, Joseph L. Tedesco, Curt A. Richter

Flexible Titanium Dioxide Memory

April 25, 2010
Author(s)
Nadine Gergel-Hackett, Laurie Stephey, Barbara Dunlap, Behrang Hamadani, David J. Gundlach, Curt A. Richter

Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices

March 15, 2010
Author(s)
Mariona Coll Bau, Oana Jurchescu, Nadine Gergel-Hackett, Curt A. Richter, Christina Hacker
Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)
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