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Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device

Published

Author(s)

Mariona Coll Bau, Nadine E. Gergel-Hackett, Oana Jurchescu, Curt A. Richter, Christina A. Hacker

Citation

Coll, M. , Gergel-Hackett, N. , Jurchescu, O. , Richter, C. and Hacker, C. (2010), Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device (Accessed February 29, 2024)
Created June 4, 2010, Updated February 19, 2017