Coll Bau, M.
, Gergel-Hackett, N.
, Jurchescu, O.
, Richter, C.
and Hacker, C.
(2010),
Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device (Accessed May 10, 2026)
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Flip Chip Lamination Approach to Fabricate Ultrasmooth Metal Contacts for Organic-based Electronic Device
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Created June 4, 2010, Updated May 7, 2026