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Metal-Molecule-Silicon Junctions Produced by Flip Chip Lamination of Dithiols

Published

Author(s)

Michael A. Walsh, Curt A. Richter, Christina A. Hacker

Abstract

The integration of organic molecules with silicon is increasingly being studied for potential uses in hybrid electronic devices. Creating dense and highly ordered organic monolayers on silicon with reliable metal contacts still remains a challenge. A novel technique, flip chip lamination (FCL), has been developed to create uniform metal-molecule-semiconductor junctions. FCL uses nanotransfer printing to covalently attach self-assembled monolayers to a hydrogen-passivated Si(111) surface. Several dithiol molecules were studied to explore the role of molecular length and chemical structure on the physical and electronic properties of the molecules. The effects of the FCL process on the chemical and physical properties of the imbedded molecular layer were interrogated with p-polarized-backside reflectance absorption infrared spectroscopy. Electrical measurements were also performed to characterize device structure and to offer better insight into the mechanisms at play in the electronic transport.
Citation
ECS Transactions
Volume
35
Issue
3

Citation

Walsh, M. , Richter, C. and Hacker, C. (2011), Metal-Molecule-Silicon Junctions Produced by Flip Chip Lamination of Dithiols, ECS Transactions, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=907875 (Accessed July 20, 2024)

Issues

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Created February 1, 2011, Updated February 19, 2017