Hacker, C.
, Coll, M.
and Richter, C.
(2010),
Metrology of Molecular Devices made by Flip Chip Lamination, ECS Transactions, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=904896
(Accessed December 9, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Metrology of Molecular Devices made by Flip Chip Lamination
Published
Author(s)
, ,
Abstract
Scaling of conventional electronics has continued unabated to dimensions approaching fundamental physical limits. As technology continues to evolve there are increasing demands to identify alternate routes of performing electrical functions. One potential alternate technology is molecular electronics. We have focused efforts on silicon-based molecular electronic devices and have developed a crucial understanding of the formation and characterization of molecular electronic devices. The fabrication and metrology of molecular based devices has progressed but remains challenging. This paper gives an overview of our technology highlighting formation of monolayers and metallization of the monolayers. Characterization of metal-monolayer-silicon structures will be discussed throughout.Citation
ECS Transactions
Volume
28
Issue
2
Pub Type
Journals
Download Paper
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created April 30, 2010, Updated February 19, 2017