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Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices

Published

Author(s)

Mariona Coll Bau, Oana Jurchescu, Nadine Gergel-Hackett, Curt A. Richter, Christina Hacker

Abstract

Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)

Citation

Coll Bau, M. , Jurchescu, O. , Gergel-Hackett, N. , Richter, C. and Hacker, C. (2010), Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices (Accessed February 29, 2024)
Created March 14, 2010, Updated October 12, 2021