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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 276 - 300 of 333

Modeling Superconformal Electrodeposition Using the Level Set Method

May 1, 2003
Author(s)
Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Superconformal filling (superfill) occurs when a high aspect ratio feature on a silicon wafer fills due to preferential metal deposition on the bottom surface that permits it to escape before deposition on the side walls causes them to close off. This

Superconformal Silver Deposition using KSeCn Derivatized Substrates

May 1, 2003
Author(s)
B C. Baker, C Witt, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Superconformal filling of sub-micrometer trenches was achieved using substrates that were catalyzed with KSeCn prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was found to be dependent on the time the

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor

April 3, 2003
Author(s)
Daniel Josell, S D. Kim, Daniel Wheeler, Thomas P. Moffat, S G. Pyo
The mechanism behind superconformal filling of fine features during surfactant catalyzed chemical vapor deposition is described and the metrology required to predict it is identified and quantified. The impact of adsorbed iodine coverage on copper

Accelerator Aging Effects During Copper Electrodeposition

April 1, 2003
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, Daniel Josell
Slow sweep rate voltammetric analysis of the Cu/Cu(II) deposition reaction is shown to be an effective tool for examining aging effects associated with thiol and disulfide additives that are widely employed as brighteners. Sulfonate-terminated short chain

Superconformal Electrodeposition of Silver from a KAg(CN) 2 -KCN-KSeCN Electrolyte

February 1, 2003
Author(s)
B C. Baker, M Freeman, B Melnick, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Electrodeposition of silver from a KAg(CN) 2-KCN electrolyte was investigated. The addition of potassium selenocyanate (KSeCN) results in a hysteretic current-voltage response, specular films and superconformal growth in submicrometer vias. These

A Mechanism for Brightening: Linear Stability Analysis of the Curvature Enhanced Coverage Model

January 6, 2003
Author(s)
Geoffrey B. McFadden, Sam R. Coriell, Thomas P. Moffat, Daniel Josell, Daniel Wheeler, W Schwarzacher
This work presents experiments and theory describing a mechanism for how brighteners in electrolytes function. The mechanism involves change of local coverage of a deposition rate enhancing catalyst adsorbed on the surface through change of local surface

Superconformal Electrodeposition Using Derivitized Substrates

December 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, C Witt, Daniel Josell
This paper demonstrates superconformal electrodeposition of copper in trenches using a two step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte

Superconformal Film Growth

October 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
Superconformal electrodeposition of copper is explained by the recently developed curvature enhanced accelerator coverage (CEAC) mechanism. The model stipulates that 1. the growth velocity is proportional to the local accelerator, or catalyst, surface

Magnetic Properties of Ultrathin Laminated Co/Cu Films Prepared by Electrodeposition

September 1, 2002
Author(s)
M Shima, L Salamanca-Riba, Thomas P. Moffat, Robert D. McMichael
The magnetic properties of a series of electrodeposited [Co(x ML)/Cu(17 ML)]100 multilayers have been examined as a function of the cobalt layer thickness. The multilayers were grown on Si(100)covered with a highly textured Cu(100) seed alyer. Films with a