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Quantifying Superconformal filling of the Submicrometer Features Through Surfactant Catalyzed Chemical Vapor Deposition

Published

Author(s)

Daniel Josell, S D. Kim, Daniel Wheeler, Thomas P. Moffat, S G. Pyo

Abstract

This work presents the fundamentals for understanding the superconformal deposition observed during surfactant catalyzed chemical vapor deposition. The mechanism underlying the bottom-up deposition process is noted to be identical to that underlying the superfill process of copper electrochemical deposition used for fabricating metallizations in fine vias and trenches.
Proceedings Title
Chemical Vapor Deposition, International Conference | 16th | | Electrochemical Society
Volume
No. 8
Conference Dates
April 1, 2003
Conference Location
Paris, 1, FR
Conference Title
Proceedings of the Electrochemical Society

Keywords

catalyst, chemical vapor deposition, copper, iodine, superconformal deposition, superfill, surfactant, trenches, vias

Citation

Josell, D. , Kim, S. , Wheeler, D. , Moffat, T. and Pyo, S. (2003), Quantifying Superconformal filling of the Submicrometer Features Through Surfactant Catalyzed Chemical Vapor Deposition, Chemical Vapor Deposition, International Conference | 16th | | Electrochemical Society, Paris, 1, FR (Accessed May 26, 2024)

Issues

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Created March 31, 2003, Updated October 12, 2021