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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 251 - 275 of 333

Artifacts in Ballistic Magnetoresistance Measurements

June 1, 2004
Author(s)
William F. Egelhoff Jr., L Gan, H Ettedgui, Y Kadmon, Cedric J. Powell, P J. Chen, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles, Erik B. Svedberg
We have studied the behavior of electrodeposited Ni and Fe nanocontacts in magnetic fields and the changes in resistivity (Δ}R) that occur. Metallic particles suspended in plating solution, created and collected from the electroplating bath of a

Artifacts in Ballistic Magnetoresistance Measurements

June 1, 2004
Author(s)
William F. Egelhoff Jr., L Gan, H Ettendgui, Y Kadmon, Cedric J. Powell, P J. Chen, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
We have carried out an extensive search for credible evidence to support the existence of a ballistic magnetoresistance (BMR) effect in magnetic nanocontacts. We have investigated both thin-film and thin-wire geometries for both mechanically-formed and

Superconformal Deposition and the CEAC Mechanism

February 27, 2004
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
The mechanism and modeling of superconformal film growth used in the electrochemical fabrication of 3-D Cu interconnects is briefly reviewed. The central role of electrolyte additives in controlling feature filling is fully described by the curvature

An Exact, Algebraic Solution for the Incubation Period of Superfill

January 1, 2004
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Recent publications have used the impact of area change coupled with conservation of adsorbed catalyst to quantify the superfill effect of bottom-up feature filling during electrodeposition and chemical vapor deposition. This work describes how that

Artifacts that mimic ballistic magnetoresistance

January 1, 2004
Author(s)
William F. Egelhoff Jr., L Gan, Erik B. Svedberg, Cedric J. Powell, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
We have investigated the circumstances underlying recent reports of very large values of ballistic magnetoresistance (BMR) in nanocontacts between magnetic wires. We find that the geometries used are subject to artifacts due to motion of the wires that

Resistance Changes Similar to Ballistic Magnetoresistance in Electrodeposited Nanocontacts

January 1, 2004
Author(s)
J Mallett, Erik B. Svedberg, H Ettedgui, Thomas P. Moffat, Alexander J. Shapiro, P J. Chen, L Gan
We have devloped an electrochemical system to allow the resistance of two metal microelectrodes grown to contact to be established and maintained automatically. A thin-film geometry was used for the microelectrodes to suppress the magnetoresistive artifact

Structure and Magnetic Properties of Electrodeposition Co on n-GaAs (001)

September 19, 2003
Author(s)
A X. Ford, John E. Bonevich, Robert D. McMichael, Mark D. Vaudin, Thomas P. Moffat
Co thin films have been electrodeposited on n-type (001) GaAs. The structure and texture of the films were investigated using x-ray diffraction (XRD) and transmission electron microscopy (TEM) while the magnetic properties were examined using a vibrating

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

August 4, 2003
Author(s)
Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat
Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on

Influence of a Catalytic Surfactant on Roughness Evolution During Film Growth

July 24, 2003
Author(s)
Daniel Wheeler, Thomas P. Moffat, Geoffrey B. McFadden, Sam R. Coriell, Daniel Josell
celerator Coverage (CEAC) based mechanism for the impact of additives on the evolution of surface roughness is explained; the CEAC mechanism accounts for the conservation of locl coverage of adsorbed catalyst on a deforming interface. It has recently been