Artifacts in Ballistic Magnetoresistance Measurements

Published

June 1, 2004

Author(s)

William F. Egelhoff Jr., L Gan, H Ettedgui, Y Kadmon, Cedric J. Powell, P J. Chen, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles, Erik B. Svedberg

Abstract

We have studied the behavior of electrodeposited Ni and Fe nanocontacts in magnetic fields and the changes in resistivity (Δ}R) that occur. Metallic particles suspended in plating solution, created and collected from the electroplating bath of a nanocontact that later exhibited high values of Δ}R/R, have been successfully transferred to a second set of electrodes where similar high values of Δ}R/R were measured without any plating process being performed. We attribute this effect to a mechanical reorientation of magnetic nanoparticles at the junction between the electrodes as the field is close to zero, and relate this work to present work with ballistic magnetoresistance in nanocontacts. We also show that Fe whiskers brought in close contact can produce this effect as well.

Citation

Journal of Applied Physics

Volume

95

Issue

No. 11

Pub Type

Journals

Keywords

Al, Au, Co, Cu, Fe, Ni, oxidation barrier, Ta films

Citation

Egelhoff Jr., W. , Gan, L. , Ettedgui, H. , Kadmon, Y. , Powell, C. , Chen, P. , Shapiro, A. , McMichael, R. , Mallett, J. , Moffat, T. , Stiles, M. and Svedberg, E. (2004), Artifacts in Ballistic Magnetoresistance Measurements, Journal of Applied Physics (Accessed October 27, 2025)